<![CDATA[EC21 New Product Catalogs - copper clad laminate]]> <![CDATA[Aluminum Base PCB for LED]]> <![CDATA[PCB Glassfiber Mat]]> <![CDATA[Graphite & Carbon Fiber Fabric]]> <![CDATA[High Pressure Laminating Press]]> <![CDATA[SB 328F Copper Clad Laminate]]> <![CDATA[fiberglass tissue]]> <![CDATA[Aluminum PCB]]> <![CDATA[Aluminum PCB]]> <![CDATA[FR-1/FR-4 Copper Clad Laminate]]> <![CDATA[FR-4 Copper Clad Laminate ]]> <![CDATA[Double Belt Press]]> <![CDATA[Aluminum-based PCB]]> <![CDATA[Sell Fep Film,Fep Tube (Polyworld@163.Com)]]> <![CDATA[B-grade Copper Clad Laminate ]]> <![CDATA[Copper Clad Laminate]]> <![CDATA[Copper Clad Laminate]]> <![CDATA[Thin Core & Copper Clad Laminate]]> 140 oC) Phenolic cured (Dicy Free) system High Td (decomposition temp. > 340 oC by TGA) Lead]]> <![CDATA[High Tg Copper Clad Laminate FR4]]> 170 oC) Phenolic cured (Dicy Free) system High Td (decomposition temp. > 340 oC by TGA) Lead]]> <![CDATA[Copper Clad Laminate Halogen Free FR4]]> <![CDATA[High Tg Copper Clad Laminate FR4 ]]> 170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp.]]> <![CDATA[Copper Clad Laminate High Tg FR4]]> 170 oC by TMA method Excellent Through hole reliability High Heat Resistance (>2000 hr) Good CAF]]> <![CDATA[Metal Core and Heavy Copper Clad Laminate. ]]> <![CDATA[High Frequency Circuit Boards]]> <![CDATA[Tbba ]]> <![CDATA[Copper Clad Laminates(CCL)]]>