1.Features:
HY-9055# is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. The flame retardant UL94-V0 level can be achieved. It mainly applied in electronic components surface with materials of PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.

2.Application:
- high powered electronics,
- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.
It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.
3.TECHNICAL GUIDELINES:
a Pls put part A and part B in separate container and stir evenly before mixing the two part together.
b Weight Ratio: part A: part B = 1:1
c Degeneration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.
d The temperature influences the curing time of HY-9055#. When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. Suggested operation time and temperature. With temperature of 80~100 centigrade, the silicone will cure in 15 minutes, while in 25 centigrade room temperature, the silicone will cure around 8 hours.


Any further information pls feel free to contact with Ms Nina
Shenzhen Hong Ye Jie Technology Co., Ltd.

Related Keywords : silicone rubber,electronic silicone,liquid silicone,silicone encapsulant