TAB Bonding M/C
Application:The machine is used for bonding FPC, COF, TAB to various LCD substrate and PCB.
A.Double cylinders of pressure system can eliminate deadweight of bond head. Minimum pressure accuracy is 0.1 kg.
B.High strength and high precision aluminum of LCD table avoid distortion, dislocation and clearance.
C.Three circuit of bond head, adjustable to mass-production, manual mode and testing mode, solve the inconvenience of up-down movement.
D.Stepping memory system and auto-location solve the inconvenience of table movement.
E.Imported vision system, controlling system and temperature system.
Voltage: AC220V 50-60HZ
Rating Power: 1.5kw(constant heat) 4kw (Pulse Heat)
Heat Mode: Constant heat and pulse heat
Operation Mode: 7" interface
LCD Table: Servo memory and auto location
Bond Head: 60mm(constant heat) 50mm(pulse heat)
Fixture: Micrometer adjust
Thermocouple: K type
Rolling Mode: Auto
Program Control: PLC and servo controller
Vision system: Two C/C CCD
Dimension: L1200 x W895 x 1440mm
Business Registry Number: 120-86-03931