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Sell New Etek

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Sell New Etek
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Date Posted : 2009/08/05
Category : Manufacturing & Processing Machinery > Other Manufacturing & Processing Machinery
Offer Type : Sell
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Shenzhen June� Automation Co., Ltd.

Membership Type : Free member
Registration Date : 2009-07-22
Country/Region : Malaysia China
Address : 4/F, 1st Building, No 142, Zhu Guang Bei Lu, Nanshan Shenzhen Guangdong, China
Phone : 86-755-86238792
Fax : 86-755-86238633
Contact : Kevin Zhang

View all selling leads of this member(4)
View all products of this member (4)

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UPH:14K
High Accuracy Performance: 2.5mil Bond Pad Size
X/Y Travel:4"*4"
Table: + -180
Z Travel:0.47inch/12mm
Z Resolution:+ -0.05mil
Bond Angle:30/90
Bond head clearance:4.8mm
Flexible Work Chuck for Various Products
Automatic Wire Loading System
Automatic Wire Loss Detection
Intelligent PR System (iPR)
LCD touch screen
Bilingual Menu
Power 800W
Dimension 760 x 1050x 1450mm
Weight 280 kgs


Related Keywords: Wire bonder
Other Selling Leads of this member (3 more)
Sell June Chip 450

Sell June Chip 450
June- Chip 450 Average Cycle Time: 450ms / cycle UPH:8K Wafer X/Y :8"*8" Workholder X/Y :10"*6" Die Placement Accuracy:+-0.5mil Die Size:5mil-120mil Wafer Diameter: 6" /8"/10" Flexible and Changeable Collet Head Automatic Inspection ...
Sell CT3100

Sell CT3100
CT3100 Cycle Time :8 Wires/ Sec UPH:10K High Accuracy Performance: 2.5mil Bond Pad Size X/Y Travel:3"*3" Table:+-180 Z Travel:0.47inch/12mm Z Resolution:+-0.05mil Bond Angle:30 Bond head clearance:4.8mm Flexible Work Chuck for Var...
Sell June Chip 300 (For LED)

Sell June Chip 300 (For LED)
June-Chip 300 Automatic Die Bonder Universal Applications for Digital, Matrix, Super Flux LED, SMD LED, Chip @LED,lamp etc. Average Cycle Time: 420ms / cycle UPH:12K Wafer X/Y :6"*6" Work holder X/Y :10"*6" Die Placement Accuracy:+ - 0.5...