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Our ingot slicing beams for use in fixturing various semiconductor materials in preparation for the wafering process. These substrates can be fully customized to accomodate various ingot diameter and lengths as well as custom designed to meet specific user requirements. The ingot slicing beams are available in a variety of material formulations allowing use in multiple wafering processes including slurry wire slicing, diamond wire slicing and ID saw slicing. The unique surface conditions of these slicing beams have a high affinity for epoxy adhesives and prevent epoxy residue from remaining on sliced wafers in post slice demounting and cleaning applications
Photovoltaic Slicing Beam is made of a unique composite polymer proven to be very effective with wire saw slicing equipment for photovoltaic wafer processing. The substrate materials are electrically insulating and can be mounted directly to wire saw mounting fixtures, eliminating the need for glass and other substrates. The unique surface characteristics promote improved adhesive bonding with improved dimensional stability compared to conventional graphite and glass products. The beams are available in various sizes to accommodate photovoltaic ingots as large as 200 mm.
Packing : carton+pallet
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Business Registry Number: 120-86-03931