<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - tool for mesh]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/tool_for_mesh--2001/1/tool for mesh.html]]></link><item>
<title><![CDATA[Electroplated Diamond Wheel  Diamond Wheel  Diamond Grinding Wheel]]></title><link><![CDATA[https://sdrx.en.ec21.com/Electroplated_Diamond_Wheel_Diamond_Wheel--12044422_12047434.html]]></link><description><![CDATA[mesh) for rapid material removal to fine (e.g., 1000 - 1200 mesh) for achieving a mirror - like finish. The appropriate grain size can be selected according to the specific application requirements.3]]></description><pubDate><![CDATA[20250307]]></pubDate></item>
<item>
<title><![CDATA[Electroplated Diamond Band Saw Blades]]></title><link><![CDATA[https://jason3162.en.ec21.com/Electroplated_Diamond_Band_Saw_Blades--11775343_11785489.html]]></link><description><![CDATA[For straight cuts,
specify the maximum possible band height.
For contours, band height should be selected as follows:
2. Diamond Mesh/Grit Size
Recommended diamond size will vary depending on applica]]></description><pubDate><![CDATA[20230510]]></pubDate></item>
<item>
<title><![CDATA[Diamond Blade for Granite Marble]]></title><link><![CDATA[https://stonetoolskorea.en.ec21.com/Diamond_Blade_for_Granite_Marble--10092622_10092852.html]]></link><description><![CDATA[/ email: sales [at ] stonetools.co.kr 
　
Diamond Tools Mobile Website for RM Tech Korea (StoneTools Korea&amp;reg;) 
Please, checkout our new Mobile Website
　
　
　
　
　
　
　
　
　
]]></description><pubDate><![CDATA[20160804]]></pubDate></item>
<item>
<title><![CDATA[Diameter 900 Resin Bond Diamond Grinding Wheel for HVOF Carbide and Ceramic Coatings]]></title><link><![CDATA[https://roberthc2023.en.ec21.com/Diameter_900_Resin_Bond_Diamond--11596639_11629930.html]]></link><description><![CDATA[for HVOF ceramic coating:
1. Surface grinder,
2. PCD/PCBN tools grinding,
3. Tungsten carbide grinding,
4. Glass grinding
5. Stone grinding
Specification of Resin bond Diamond Cylindrical Grinding Wh]]></description><pubDate><![CDATA[20220830]]></pubDate></item>

</channel>
</rss>