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<title><![CDATA[EC21 Product Catalogs - silicon wafer cutting]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/silicon_wafer_cutting--2002/1/silicon wafer cutting.html]]></link><item>
<title><![CDATA[High Sharpness Synthetic Diamond Grit RVD Green Diamond for Grinding Wheel Making]]></title><link><![CDATA[https://ivy125banner.en.ec21.com/High_Sharpness_Synthetic_Diamond_Grit--10847901_10848920.html]]></link><description><![CDATA[silicon wafer.
3. Application in ceramic bond abrasive tools: it can meet the demand of high precision grinding and high efficient grinding for difficult-to-cut materials and common materials, and al]]></description><pubDate><![CDATA[20250327]]></pubDate></item>
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<title><![CDATA[Black Silicon Carbide Micro Powder]]></title><link><![CDATA[https://hsa2022.en.ec21.com/Black_Silicon_Carbide_Micro_Powder--11604696_11604738.html]]></link><description><![CDATA[wafer cutting, crystal cutting and grinding, automobile engine original parts manufacturing, special coating industry, rubber and plastic products modification, desulfurization, power supply, environ]]></description><pubDate><![CDATA[20220718]]></pubDate></item>
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<title><![CDATA[Diamond Fiber Optic Polishing Paper for Connectors]]></title><link><![CDATA[https://zksfiber.en.ec21.com/Diamond_Fiber_Optic_Polishing_Paper--11869227_11869228.html]]></link><description><![CDATA[wafer (gallium arsenide, indium phosphide etc.)
·Edge polishing for silicon wafer
Usage:
1.Cutting angle of fiber optic connector, rough grinding, medium grinding, fine grinding
2.Grinding and polis]]></description><pubDate><![CDATA[20231122]]></pubDate></item>

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