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<title><![CDATA[EC21 Product Catalogs - reactive printed]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/reactive-printed--054201/1/reactive printed.html]]></link><item>
<title><![CDATA[L-6118 Modified Epoxy Acrylate Resin]]></title><link><![CDATA[https://lencolo37.en.ec21.com/L-6118-Modified-Epoxy-Acrylate--11837345_11846027.html]]></link><description><![CDATA[Description 
L-61 18 is modified epoxy acrylate resin, with characteristics of high toughness, coatability, high reflection reactivity etc. It is highly recommended for light curing fields such as co]]></description><pubDate><![CDATA[20230919]]></pubDate></item>
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<title><![CDATA[PUR Hot Melt Adhesive]]></title><link><![CDATA[https://raywincoating.en.ec21.com/PUR-Hot-Melt-Adhesive--11794932_11794937.html]]></link><description><![CDATA[reactive hot melt adhesive
, mainly used for bonding metal, glass, wood, PC, ABS plastic and other materials, and has good adhesion to glass with printed layers. BGP Adhesive
has the advantages of fa]]></description><pubDate><![CDATA[20231007]]></pubDate></item>

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