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  • BGA PCB Assembly

    • Min. Order:  

      100 Set

    • Price:  

      US$ 300

    • Place of origin:  

      China

    A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's l

    [Related Keywords : BGA PCB Assembly]

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