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<title><![CDATA[EC21 Product Catalogs - thermal conductivity substrate]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/thermal_conductivity_substrate--2810/1/thermal conductivity substrate.html]]></link><item>
<title><![CDATA[Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Thermal_Conductive_Material_Alumina_Ceramic--12057378_12057593.html]]></link><description><![CDATA[thermal resistance and cost.
AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation.
Specification
Silicon Ca]]></description><pubDate><![CDATA[20260529]]></pubDate></item>
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<title><![CDATA[99% High Quality AIN Aluminium Nitride Ceramic Sheet Plate Disc Part for Lab Industry]]></title><link><![CDATA[https://penscmolly123.en.ec21.com/99_High_Quality_AIN_Aluminium--12003558_12004660.html]]></link><description><![CDATA[thermal conductivity aluminum nitride ceramic substrate6.Synthesize high-quality LED fluorescent powder7.Thermal conductive filler
Our factory
PENSC is a high-tech enterprise specializing in the rese]]></description><pubDate><![CDATA[20240914]]></pubDate></item>
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<title><![CDATA[Precision-Engineered Alumina Ceramic Substrates for Automotive Catalysts]]></title><link><![CDATA[https://aluminaplatefactory.en.ec21.com/Precision_Engineered_Alumina_Ceramic_Substrates--11972049_11972053.html]]></link><description><![CDATA[Thermal Properties
Max. Service Temperature (non-loading)
/
ºC
1200
CTE (coefficient of thermal expansion)
200-800ºC
1×10-6/ºC
7.8
Thermal Conductivity
25ºC
W/m·K
&gt;24
Thermal Shock Resistance
8]]></description><pubDate><![CDATA[20240720]]></pubDate></item>
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<title><![CDATA[Aluminum Nitride Sheet]]></title><link><![CDATA[https://attelements.en.ec21.com/Aluminum_Nitride_Sheet--11822808_11854509.html]]></link><description><![CDATA[thermal conductivity with strong electrical resistance, making AlN an excellent solution for many electronic applications. Unlike most electrically insulative materials — which are often also therm]]></description><pubDate><![CDATA[20231014]]></pubDate></item>
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<title><![CDATA[Aluminum Nitride Ceramics Structural Parts]]></title><link><![CDATA[https://middiaceramics305.en.ec21.com/Aluminum_Nitride_Ceramics_Structural_Parts--11863537_11869504.html]]></link><description><![CDATA[substrate has extremely high thermal conductivity, non-toxic, corrosion resistance, high temperature resistance, good thermochemical stability, etc. It is an ideal packaging material and heat dissipa]]></description><pubDate><![CDATA[20231123]]></pubDate></item>
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<title><![CDATA[White Industrial Ceramic Parts Heat Conduction and Heat Dissipation Insulation High Brightness LED]]></title><link><![CDATA[https://ceramicsindustrial.en.ec21.com/White_Industrial_Ceramic_Parts_Heat--11852462_11852463.html]]></link><description><![CDATA[thermal conductivity and good electrical insulation properties, and has the following advantages : ( 1 ) Aluminum nitride has high thermal conductivity. The theoretical thermal conductivity at room t]]></description><pubDate><![CDATA[20231010]]></pubDate></item>
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<title><![CDATA[Alumina Ceramic  Substrate]]></title><link><![CDATA[https://zhanghongb.en.ec21.com/Alumina_Ceramic_Substrate--11835182_11835235.html]]></link><description><![CDATA[substrate has the main advantages of high temperature resistance, high electrical insulation, low dielectric constant and dielectric loss, large thermal conductivity, good chemical stability, and the]]></description><pubDate><![CDATA[20230818]]></pubDate></item>
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<title><![CDATA[Ceramic Substrate]]></title><link><![CDATA[https://blueskycs8.en.ec21.com/Ceramic_Substrate--5461106_7090952.html]]></link><description><![CDATA[Material for alumina ceramic substrate :95-99 Alumina Application: widely used in the electronics industry thick-film circuit, large-scale integrated circuits, mixed IC, semiconductor packaging, chip]]></description><pubDate><![CDATA[20120916]]></pubDate></item>

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