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<title><![CDATA[EC21 Product Catalogs - conduction modules]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/conduction_modules--100301/1/conduction modules.html]]></link><item>
<title><![CDATA[Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Electronic_Substrate_Heat_Sinks_Thermal--12057378_12057589.html]]></link><description><![CDATA[modules generate a large amount of heat during operation. The AlSiC material is usually used to fabricate the IGBT substrate, and the high-power IGBT module is firmly packaged, so that the chip can
b]]></description><pubDate><![CDATA[20260602]]></pubDate></item>
<item>
<title><![CDATA[Aluminum Nitride Insulating Ceramic Cheet]]></title><link><![CDATA[https://fjhuaqing.en.ec21.com/Aluminum_Nitride_Insulating_Ceramic_Cheet--4491489_4724903.html]]></link><description><![CDATA[conductivity (30ºC)
W/m.k
≥170
(20ºC to 300ºC)
Thermal expansivity 
(300ºC to 800ºC)
×10-6/ºC
4.4
×10-6/ºC
4.8
Mechanical Properties 
Flexural strength
MPa
420
Modulus of elasticity
GPa
32]]></description><pubDate><![CDATA[20230407]]></pubDate></item>

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