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<title><![CDATA[EC21 Product Catalogs - expansion module]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/expansion_module--100301/1/expansion module.html]]></link><item>
<title><![CDATA[Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Electronic_Substrate_Heat_Sinks_Thermal--12057378_12057589.html]]></link><description><![CDATA[expansion coefficient, and flexural strength.
Specification
Silicon Carbide 
volume fraction 55 % 
Density（g/cm³）
2.96
Elastic Modulus（GPa）
195±5 
Bending Strength（MPa）
500
Tensile Stre]]></description><pubDate><![CDATA[20260526]]></pubDate></item>
<item>
<title><![CDATA[Aluminum Nitride Insulating Ceramic Cheet]]></title><link><![CDATA[https://fjhuaqing.en.ec21.com/Aluminum_Nitride_Insulating_Ceramic_Cheet--4491489_4724903.html]]></link><description><![CDATA[expansion similar to Si 
13.No toxicity
14. Free sample 
15. Fast shipment
Application:
1. HBLED
2. optical-communication 
3. High-power RF Devices
4. Power Electronic Devices
5. Power Module
6. Spec]]></description><pubDate><![CDATA[20230407]]></pubDate></item>

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