<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - igbt module]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/igbt_module--100301/1/igbt module.html]]></link><item>
<title><![CDATA[Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Electronic_Substrate_Heat_Sinks_Thermal--12057378_12057589.html]]></link><description><![CDATA[IGBT (Insulated Gate Bipolar Transistor) modules generate a large amount of heat during operation. The AlSiC material is usually used to fabricate the IGBT substrate, and the high-power IGBT module i]]></description><pubDate><![CDATA[20260520]]></pubDate></item>
<item>
<title><![CDATA[Aluminum Nitride Insulating Ceramic Cheet]]></title><link><![CDATA[https://fjhuaqing.en.ec21.com/Aluminum_Nitride_Insulating_Ceramic_Cheet--4491489_4724903.html]]></link><description><![CDATA[Module
6. Special Cooling Device
Different shapes and dimensions are available via laser cutting or customize.
Property Index of AlN ceramic substrates
Property Sort
Property Content
Unit
Property In]]></description><pubDate><![CDATA[20230407]]></pubDate></item>

</channel>
</rss>