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<title><![CDATA[EC21 Product Catalogs - thermal heating system.]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/thermal_heating_system.--100301/1/thermal heating system..html]]></link><item>
<title><![CDATA[Ceramic Substrate,Ceramic Material,Ceramic Metallize,AlSiC,AlSiC Plate,Ceramic Plate]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Ceramic_Substrate_Ceramic_Material_Ceramic--12057378_12057515.html]]></link><description><![CDATA[Thermal Expansion（10-6/K）
7-17
Thermal Conductivity（W/m·K）
Customized
Product Features
-Adjustable coefficient of thermal expansion (CTE)
-Excellent thermal conductivity and heat dissipation]]></description><pubDate><![CDATA[20260709]]></pubDate></item>
<item>
<title><![CDATA[COB Ceramic Substrate Integrated, Electronic Accessories and Supplies]]></title><link><![CDATA[https://ceramicpcb.en.ec21.com/COB_Ceramic_Substrate_Integrated_Electronic--11797353_11797370.html]]></link><description><![CDATA[thermal heating, high pressure, and the problem.
Main materials：Al2O3 and AlN substrate.
Image layers metal：Ti, TiW, Cu , Ni, Pd , Au , Ag, AuSn, Sn, Al…and other metallize。
Primary market：]]></description><pubDate><![CDATA[20240117]]></pubDate></item>

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