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<title><![CDATA[EC21 Product Catalogs - wind solar combination]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/wind_solar_combination--100301/1/wind solar combination.html]]></link><item>
<title><![CDATA[Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Electronic_Substrate_Heat_Sinks_Thermal--12057378_12057589.html]]></link><description><![CDATA[combination of high thermal conductivity, low thermal expansion coefficient, and flexural strength.
Specification
Silicon Carbide 
volume fraction 55 % 
Density（g/cm³）
2.96
Elastic Modulus（GPa]]></description><pubDate><![CDATA[20260529]]></pubDate></item>

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