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<title><![CDATA[EC21 Product Catalogs - thermal conductivity pad]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/thermal-conductivity-pad--1005/1/thermal conductivity pad.html]]></link><item>
<title><![CDATA[Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Thermal-Pad-0.1mm-Al-SiC--12057378_12057738.html]]></link><description><![CDATA[thermal resistance and cost.
AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation.
It is lightweight and ca]]></description><pubDate><![CDATA[20260413]]></pubDate></item>
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<title><![CDATA[Bergquist GAP PAD A3000 Gap Pad Tgp A2600]]></title><link><![CDATA[https://carrie0828.en.ec21.com/Bergquist-GAP-PAD-A3000-Gap--11384909_11430136.html]]></link><description><![CDATA[Features and Benefits1.Thermal conductivity: 2.6 W/m-K 2.Fiberglass-reinforced for puncture, shear and tear resistance 3. Reduced tack on one side to aid in application assembly 4. Electrically isola]]></description><pubDate><![CDATA[20241015]]></pubDate></item>
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<title><![CDATA[2-15W/Mk THERMAL PAD COMMON SERIES]]></title><link><![CDATA[https://emtron11.en.ec21.com/2-15W-Mk-THERMAL-PAD--11931195_11931196.html]]></link><description><![CDATA[The common thermal pads are soft which could be compressed in 
moderate range. It can fill the gap and quickly conduct heat. The 
thermal pads are inherent tacky and easy for use without back adhe-si]]></description><pubDate><![CDATA[20240430]]></pubDate></item>
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<title><![CDATA[HSR-3500 Thermal Conductive Insulator]]></title><link><![CDATA[https://echo19820828.en.ec21.com/HSR-3500-Thermal-Conductive-Insulator--11478029_11491245.html]]></link><description><![CDATA[conductorshothree HSR-3500 (Thermal Conductivity Silicone Sheet) can replace BERGQUIST SP2000,Sil Pad 2000,SIL PAD TSP 3500LAIRD TGARD-K52,LAIRD TGARD 220,DENKA BFG30,BFG45,BGF20,BGF80,DENKA FSL-BS]]></description><pubDate><![CDATA[20230606]]></pubDate></item>

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