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<title><![CDATA[EC21 Product Catalogs - baseplate]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/baseplate--1005/1/baseplate.html]]></link><item>
<title><![CDATA[Thermal Pad  Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Thermal_Pad_Al_SiC_with--12057378_12058240.html]]></link><description><![CDATA[AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduce]]></description><pubDate><![CDATA[20260529]]></pubDate></item>

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