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<title><![CDATA[EC21 Product Catalogs - bergquist bp108]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/bergquist_bp108--1005/1/bergquist bp108.html]]></link><item>
<title><![CDATA[Bergquist BP108  BOND-PLY 100 Bond-ply Tbp 850]]></title><link><![CDATA[https://carrie0828.en.ec21.com/Bergquist_BP108_BOND_PLY_100--11384909_11408113.html]]></link><description><![CDATA[Bergquist BP108 BOND-PLY 100 Bond-ply Tbp 850 
Features and Benefits
• Thermal impedance: 0.52°C-in. 2 /W
(at 50 psi)
• High bond strength to a variety
of surfaces
• Double-sided, pressure sen]]></description><pubDate><![CDATA[20240712]]></pubDate></item>

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