<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - microcomponents]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/microcomponents--1005/1/microcomponents.html]]></link><item>
<title><![CDATA[Semiconductor Assembly &amp; Packaging Services]]></title><link><![CDATA[https://standardsk.en.ec21.com/Semiconductor_Assembly_Packaging_Services--6209763_8555890.html]]></link><description><![CDATA[Standard Systems provide semiconductor packaging services to assemble die in wafer form to various package types :BGA,QFP,SO,QFN,PLCC, SOIC, PDIP, Etc...... Willing to work for Fabless and IC Design ]]></description><pubDate><![CDATA[20170517]]></pubDate></item>

</channel>
</rss>