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<title><![CDATA[EC21 Product Catalogs - ultra soft thermal pad]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/ultra_soft_thermal_pad--1005/1/ultra soft thermal pad.html]]></link><item>
<title><![CDATA[Bergquist Gap Pad Tgp 3500ulm]]></title><link><![CDATA[https://carrie0828.en.ec21.com/Bergquist_Gap_Pad_Tgp_3500ulm--11384909_11408120.html]]></link><description><![CDATA[PAD TGP 3500ULM (ultra-low modulus) is an extremely soft gap filling material with a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a u]]></description><pubDate><![CDATA[20240914]]></pubDate></item>
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<title><![CDATA[HSR-3500 Thermal Conductive Insulator]]></title><link><![CDATA[https://echo19820828.en.ec21.com/HSR_3500_Thermal_Conductive_Insulator--11478029_11491245.html]]></link><description><![CDATA[thermal conductivity, ultra-high voltage resistance,low density and low dielectric properties. The material is ultra-thin, soft, tough flexible, tough, adhesive backed and self-adhesive, it can meet ]]></description><pubDate><![CDATA[20230606]]></pubDate></item>

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