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<title><![CDATA[EC21 Product Catalogs - server cooling]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/server_cooling--0526/1/server cooling.html]]></link><item>
<title><![CDATA[Thermal Conductive Potting Adhesive]]></title><link><![CDATA[https://rszn123.en.ec21.com/Thermal_Conductive_Potting_Adhesive--11960661_11961293.html]]></link><description><![CDATA[cool or hot temperature. This potting material allows the electronic components and circuits to be free from the vibrative damages.
Features: thermal conductivity: fliud adhesive gel 0.8 ~ 3.6W/m·K,]]></description><pubDate><![CDATA[20240702]]></pubDate></item>

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