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<title><![CDATA[EC21 Product Catalogs - copp]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/copp--10120302/1/copp.html]]></link><item>
<title><![CDATA[Ultra-Thin Peelable Copper Foil,Heat-Resistant Peelable Copper Foil]]></title><link><![CDATA[https://fpcfccl.en.ec21.com/Ultra-Thin-Peelable-Copper-Foil--11938956_11939079.html]]></link><description><![CDATA[Ultra-Thin Peelable Copper Foil Ultra-Thin Peelable Copper Foil TD-FEC is ultrathin copper foil produced using vacuum sputtering and electro-deposition technology,Mainly used in IC packaging, FPC mic]]></description><pubDate><![CDATA[20240518]]></pubDate></item>

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