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<title><![CDATA[EC21 Product Catalogs - ultra thin foil]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/ultra-thin-foil--10120302/1/ultra thin foil.html]]></link><item>
<title><![CDATA[Ultra-Thin Peelable Copper Foil,Heat-Resistant Peelable Copper Foil]]></title><link><![CDATA[https://fpcfccl.en.ec21.com/Ultra-Thin-Peelable-Copper-Foil--11938956_11939079.html]]></link><description><![CDATA[Ultra-Thin Peelable Copper Foil Ultra-Thin Peelable Copper Foil TD-FEC is ultrathin copper foil produced using vacuum sputtering and electro-deposition technology,Mainly used in IC packaging, FPC mic]]></description><pubDate><![CDATA[20240518]]></pubDate></item>
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<title><![CDATA[Flexible Board FPC]]></title><link><![CDATA[https://ronghuaindustry.en.ec21.com/Flexible-Board-FPC--11791188_11799352.html]]></link><description><![CDATA[ultra-thin thickness to complete fast data reading for PC or NOTEBOOK;5. HDD (hard disk drive): The components of HDD (hard disk drive) mounting circuit and packaging board. 
Advantages:
1. FlexibleA]]></description><pubDate><![CDATA[20230530]]></pubDate></item>

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