Capacitive Bag Type Fingerprint Module

20221202

Structure: Coating Package size: 3.2-6.4mm T=0.65mm Induction type: Capacitive press type Sensing area: 3.6*3.2mm Cold screen unlock: <40ms Pixel array: 72*64 Resolution: 508 DPI FRR/FAR |FRR:<1/100

Integrated Capacitive Fingerprint Module SM-66H1 Biometric Hardwares

20240205

508 dpi capacitive sensor ●Compact design (board size as small as sensor size) for volume-limited applications ●Extra low power-consumption ●Sleep mode current less than 5uA ●Touch wake-up fu

EC21 Product Catalogs - 508

Capacitive Bag Type Fingerprint Module

Integrated Capacitive Fingerprint Module SM-66H1 Biometric Hardwares