<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - semiconductor plastic packaging]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor-plastic-packaging--0533/1/semiconductor plastic packaging.html]]></link><item>
<title><![CDATA[Polyvinylidene Fluoride Resin PVDF Pellet HD9106 Extrusion Molding]]></title><link><![CDATA[https://bellahengyi333.en.ec21.com/Polyvinylidene-Fluoride-Resin-PVDF-Pellet--11546352_11546931.html]]></link><description><![CDATA[plastic bags,again into paper barrel,each piece of 25kgs
Stored in clean, cool and dry places, avoid contamination from external substance such as dust and moisture
During transportation, avoid stren]]></description><pubDate><![CDATA[20220422]]></pubDate></item>
<item>
<title><![CDATA[100% High Purity F46 Liquid/FEP Liquid/FEP Aqueous Dispersion for Dipping and Anti-sticking Coating]]></title><link><![CDATA[https://dina2022.en.ec21.com/100-High-Purity-F46--11564050_11564125.html]]></link><description><![CDATA[Semiconductor, Food Processing, Packaging and other end use components requiring a high performance fluoroplastic material.
Attention 
The processing temperature should not exceed 420ºC to prevent t]]></description><pubDate><![CDATA[20220510]]></pubDate></item>

</channel>
</rss>