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<title><![CDATA[EC21 Product Catalogs - semiconductor packaging test]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor_packaging_test--0533/1/semiconductor packaging test.html]]></link><item>
<title><![CDATA[100% High Purity F46 Liquid/FEP Liquid/FEP Aqueous Dispersion for Dipping and Anti-sticking Coating]]></title><link><![CDATA[https://dina2022.en.ec21.com/100_High_Purity_F46_Liquid--11564050_11564125.html]]></link><description><![CDATA[Semiconductor, Food Processing, Packaging and other end use components requiring a high performance fluoroplastic material.
Attention 
The processing temperature should not exceed 420ºC to prevent t]]></description><pubDate><![CDATA[20220510]]></pubDate></item>
<item>
<title><![CDATA[Polyvinylidene Fluoride Resin PVDF Pellet HD9106 Extrusion Molding]]></title><link><![CDATA[https://bellahengyi333.en.ec21.com/Polyvinylidene_Fluoride_Resin_PVDF_Pellet--11546352_11546931.html]]></link><description><![CDATA[Performance Index : HD9106 Pellet/Powder
Properties
Test Method
Unit
HD9106
1
Appearance
Pellet/Powder
2
MFR 230 degree,5Kg
ASTM F1238
g/10min
0-25
3
Density
ASTMD792
g/cm³
1.77-1.78
4
Melting point]]></description><pubDate><![CDATA[20220422]]></pubDate></item>

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