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<title><![CDATA[EC21 Product Catalogs - copper clad laminates]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/copper-clad-laminates--100303/1/copper clad laminates.html]]></link><item>
<title><![CDATA[Copper Clad Laminate FR-4]]></title><link><![CDATA[https://rickfish.en.ec21.com/Copper-Clad-Laminate-FR-4--1027022_5546139.html]]></link><description><![CDATA[Our main products are high level Copper-clad laminate (FR-4) and prepreg
CHARACTERISTICS:
Tg135+/-5&amp;deg;C(DSC) Lower water absorption Compatible with AOI equipment Excellent UV-blocking performance G]]></description><pubDate><![CDATA[20110617]]></pubDate></item>
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<title><![CDATA[PCB Lamination Process Materials Press Pad Cushion]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/PCB-Lamination-Process-Materials-Press--12047095_12047252.html]]></link><description><![CDATA[PCB Lamination Process Materials 
Product introduction 
1. The Lamination Process Materials is like the &quot;buffering guard&quot; for lamination operations. Compared with the kraft paper widely used in lamin]]></description><pubDate><![CDATA[20250306]]></pubDate></item>

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