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<title><![CDATA[EC21 Product Catalogs - curing pad]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/curing-pad--100303/1/curing pad.html]]></link><item>
<title><![CDATA[Bergquist Gap Pad Tgp 12000ulm]]></title><link><![CDATA[https://evita0828.en.ec21.com/Bergquist-Gap-Pad-Tgp-12000ulm--11451854_11452163.html]]></link><description><![CDATA[PAD TGP 12000ULM is an extremely soft gap filling material rated at a high thermal conductivity of 12.0 W/m-K.It is specially formulated for high performance applications requiring low assembly stres]]></description><pubDate><![CDATA[20240712]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Filler Tgf 2000 GF2000]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist-Gap-Filler-Tgf-2000--11478029_11481206.html]]></link><description><![CDATA[curing system. The material provides a balance of cured material properties and good compression set (memory). The result is a soft, form-in place elastomer ideal for coupling “hot” electronic co]]></description><pubDate><![CDATA[20240709]]></pubDate></item>

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