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<title><![CDATA[EC21 Product Catalogs - filling board]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/filling_board--100303/1/filling board.html]]></link><item>
<title><![CDATA[High Temperature Resistant Three-in-One Release Film]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/High_Temperature_Resistant_Three_in--12047105_12047245.html]]></link><description><![CDATA[board and the integrity of the circuit.
It is suitable for the filling and overmolding of rigid-flexible PCB during the lamination process.
Features 
1. 
Multifunctional integration : Integrates rele]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Pad HC5.0  GAP PADTGP HC5000 BERGQUIST GPHC5.0]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Gap_Pad_HC5.0_GAP--11478029_11481252.html]]></link><description><![CDATA[BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal perfor]]></description><pubDate><![CDATA[20241212]]></pubDate></item>
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<title><![CDATA[Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Thermal_Management_Materials_3.0W_Silicone--11909846_12019370.html]]></link><description><![CDATA[board/mother board
● notebook
● power supply
● Heat pipe thermal solutions
● Memory Modules
● Mass storage devices
● Automotive electronics
Typical Properties of TIF100-30-05E
ColorBlueVi]]></description><pubDate><![CDATA[20241021]]></pubDate></item>
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<title><![CDATA[Bergquist GPHC3.0 Gap Pad  Hc 3.0 Gap Pad Tgp HC3000]]></title><link><![CDATA[https://evita0828.en.ec21.com/Bergquist_GPHC3.0_Gap_Pad_Hc--11451854_11451865.html]]></link><description><![CDATA[BERGQUIST GPHC3.0,GAP PAD HC 3.0,GAP PAD TGP HC3000 
BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K.The material offers exceptional]]></description><pubDate><![CDATA[20240712]]></pubDate></item>
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<title><![CDATA[EMI Shielding Film(Electromagnetic Interference Shielding Film)]]></title><link><![CDATA[https://fpcfccl.en.ec21.com/EMI_Shielding_Film_Electromagnetic_Interference--11938956_11939063.html]]></link><description><![CDATA[board and soft-hard combination board.Product Characteristics:1. High performance in shielding effectiveness (SE)2. Achieve consistent impedance control design3. High Filling4. PI type insulation lay]]></description><pubDate><![CDATA[20240518]]></pubDate></item>

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