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<title><![CDATA[EC21 Product Catalogs - form fill]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/form-fill--100303/1/form fill.html]]></link><item>
<title><![CDATA[Universal Waterproof Heat Shrink Solder Ring Terminal for Wire Connection]]></title><link><![CDATA[https://keyusce.en.ec21.com/Universal-Waterproof-Heat-Shrink-Solder--12062222_12062702.html]]></link><description><![CDATA[fills the gaps, forming a sealed waterproof and moisture-proof structure. It is suitable for humid or outdoor environments.
Operation specification:
1, Min. Shrink temp.: 80℃
2, Working temperature]]></description><pubDate><![CDATA[20251223]]></pubDate></item>
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<title><![CDATA[Bergquist Liqui Form Tlf 10000]]></title><link><![CDATA[https://evita0828.en.ec21.com/Bergquist-Liqui-Form-Tlf-10000--11451854_11451891.html]]></link><description><![CDATA[FORM TLF 10000 is pre-cured, requiring no mixing or refrigeration. Typical applications RRU/AAU/BBU in wireless in telecom wireless infrastructure Filling various gaps between heat-generating devices]]></description><pubDate><![CDATA[20250208]]></pubDate></item>
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<title><![CDATA[Factory Cheap Thermal Conductive Silicone]]></title><link><![CDATA[https://yl008.en.ec21.com/Factory-Cheap-Thermal-Conductive-Silicone--11958277_11965522.html]]></link><description><![CDATA[formance paste like interval filled thermal conductive material that forms according to the shape of the structure, targeting uneven ceramics and heat dissipation
The surface or irregular cavity of t]]></description><pubDate><![CDATA[20240904]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Filler Tgf 2000 GF2000]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist-Gap-Filler-Tgf-2000--11478029_11481206.html]]></link><description><![CDATA[FILLER TGF 2000 is a high performance, thermally conductive, liquid gap-filling material supplied as a two-component, room or elevated temperature curing system. The material provides a balance of cu]]></description><pubDate><![CDATA[20240709]]></pubDate></item>
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<title><![CDATA[Ultra Soft Thermal Conductive Silicon Thermal Pad for CPU GPU LED]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Ultra-Soft-Thermal-Conductive-Silicon--11911326_11911351.html]]></link><description><![CDATA[Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the &quot;S]]></description><pubDate><![CDATA[20240624]]></pubDate></item>
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<title><![CDATA[Thermal Conductive Silicon Thermal Pad 3.0w/M.K Exclusively for CPU 50*50*2mm]]></title><link><![CDATA[https://andychow12.en.ec21.com/Thermal-Conductive-Silicon-Thermal-Pad--10651189_11934116.html]]></link><description><![CDATA[formed inside the material,this kind of microporous structure not only make the pad with strong heat absorbing ability,also with the initiative heat conduction function,when filling into the gap betw]]></description><pubDate><![CDATA[20240509]]></pubDate></item>
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<title><![CDATA[Conductive Cloth Tape]]></title><link><![CDATA[https://filmtape.en.ec21.com/Conductive-Cloth-Tape--11729864_11729899.html]]></link><description><![CDATA[forming an EMI material with superior anti electromagnetic interference ability. Therefore, conductive cloth is widely used in many high-order electronic devices with high added value. It is also wid]]></description><pubDate><![CDATA[20230217]]></pubDate></item>

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