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<title><![CDATA[EC21 Product Catalogs - stress]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/stress--100303/1/stress.html]]></link><item>
<title><![CDATA[Stress Control Belt]]></title><link><![CDATA[https://casac1997.en.ec21.com/Stress_Control_Belt--11726544_11734084.html]]></link><description><![CDATA[HB1 220 Electrical Stress Control Tape
Application: 
Used for electrical stress control of cable terminal and intermediate joint under 35KV.
According to the specific installation requirements, the H]]></description><pubDate><![CDATA[20230223]]></pubDate></item>
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<title><![CDATA[High - Temperature Resistant Waterproof Three -Branch Molded Shrink Boot  for Cable Management]]></title><link><![CDATA[https://keyusce.en.ec21.com/High_Temperature_Resistant_Waterproof_Three--12059644_12061213.html]]></link><description><![CDATA[stress relief for fine wire fine forks.
Feature &amp; benefit
1.mechanical protection;
2.Insulation and flame retardancy；
3.Resistant to high temperatures, oil, and chemical corrosion；
4.Internal wal]]></description><pubDate><![CDATA[20260313]]></pubDate></item>
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<title><![CDATA[4120 Hardening Steel Separator Plate]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/4120_Hardening_Steel_Separator_Plate--12047103_12047220.html]]></link><description><![CDATA[stresses, maintaining the overall shape and performance of the laminated product. For example, in printed circuit boards, it can provide a reliable support base for numerous electronic components.
·]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Wave/Reflow Soldering Pallet Materials]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Wave_Reflow_Soldering_Pallet_Materials--12036090_12036092.html]]></link><description><![CDATA[stress.
Minimal expansion or contraction under heat.
Maintains precise dimensions, ensuring accuracy in critical applications.
3. Durability: The material is robust, ensuring a long service life even]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Pad HC5.0  GAP PADTGP HC5000 BERGQUIST GPHC5.0]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Gap_Pad_HC5.0_GAP--11478029_11481252.html]]></link><description><![CDATA[stress on components and boards during assembly. BERGQUIST GPHC5.0(Thermal Conductive Insulating Silicone Gasket) maintains a conformable nature that allows for excellent interfacing and wet-out char]]></description><pubDate><![CDATA[20241212]]></pubDate></item>
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<title><![CDATA[Paper Phenolic Laminates]]></title><link><![CDATA[https://skjaininsulations.en.ec21.com/Paper_Phenolic_Laminates--12014948_12014949.html]]></link><description><![CDATA[stress.**Versatile Applications:** From automotive to electronics, our Bakelite sheets are versatile and can be used across various industries. They are perfect for creating robust molds, fixtures, a]]></description><pubDate><![CDATA[20241008]]></pubDate></item>
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<title><![CDATA[Factory Cheap Thermal Conductive Silicone]]></title><link><![CDATA[https://yl008.en.ec21.com/Factory_Cheap_Thermal_Conductive_Silicone--11958277_11965522.html]]></link><description><![CDATA[stress during displacement is extremely small, which can meet the requirements of interface material thickness and shape in individual applications.
Advantages and features: single component use, non]]></description><pubDate><![CDATA[20240904]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Pad Tgp 12000ulm]]></title><link><![CDATA[https://evita0828.en.ec21.com/Bergquist_Gap_Pad_Tgp_12000ulm--11451854_11452163.html]]></link><description><![CDATA[stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation.BERGQUIST GAP PAD TGP 12000ULM is highly conforma]]></description><pubDate><![CDATA[20240712]]></pubDate></item>
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<title><![CDATA[Thermal Gel]]></title><link><![CDATA[https://emtron11.en.ec21.com/Thermal_Gel--11931195_11937493.html]]></link><description><![CDATA[low stress
• Suitable for multi tolerance scenarios
• Automatic dispensing
TYPICAL APPLICATION• Power IC
• Telco Base Station
• Thermoelectric Cooling Device
• CPU
• IGBT Module
]]></description><pubDate><![CDATA[20240515]]></pubDate></item>
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<title><![CDATA[Thin Wall Heat Shrink Tubing with Glue Waterpoof Sealing]]></title><link><![CDATA[https://upolymer.en.ec21.com/Thin_Wall_Heat_Shrink_Tubing--1688741_11920059.html]]></link><description><![CDATA[stress relief, including connectors, wiring harnesses, electronic components, etc. 
Features Operating temperature: -40~125 ℃ Minimum full shrinkage temperature: 125 ℃ Shrink ratio: 3:1 &amp; 4:1 &amp; 2]]></description><pubDate><![CDATA[20240403]]></pubDate></item>
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<title><![CDATA[Arrester Silicone Rubber]]></title><link><![CDATA[https://yfpower.en.ec21.com/Arrester_Silicone_Rubber--11836088_11870417.html]]></link><description><![CDATA[Arrester silicone rubber is also highly resistant to abrasion, chemical attack, and mechanical stresses, providing long-lasting protection against surges and other electrical disturbances. 
]]></description><pubDate><![CDATA[20231127]]></pubDate></item>
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<title><![CDATA[EPGC201/202/203/204/205/308  Laminated Sheet G11]]></title><link><![CDATA[https://iamjessica.en.ec21.com/EPGC201_202_203_204_205--2654310_2656086.html]]></link><description><![CDATA[stresses with high resistance to fatigue.
4. SIZES TOLERANCE (mm)
Width
450 - 1230
± 15
Length
&gt; 980 - 2470
± 25
5. NORMAL THICKNESS (mm)
Normal Thickness
Tolerance
Normal Thickness
Tolerance
0.2, ]]></description><pubDate><![CDATA[20230824]]></pubDate></item>
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<title><![CDATA[Three-poles Bushing Insulators for Switchgear 24kV]]></title><link><![CDATA[https://chinahzsgdq.en.ec21.com/Three_poles_Bushing_Insulators_for--4984479_5027641.html]]></link><description><![CDATA[stress products to maximize the mechanical properties of products. 
3. Silica add activity to further improve the mechanical properties of epoxy resin, but also to ensure that the insulation work in ]]></description><pubDate><![CDATA[20130524]]></pubDate></item>

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