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Min. Order:
10 Piece
Price:
US$ 1
Place of origin:
United States
BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
[Related Keywords : GAP PAD TGP HC5000, Gap Pad HC5.0, BERGQUIST GPHC5.0]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
51 - 100
Annual Revenue
More than 100,000,000
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