<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - card pad]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/card_pad--100303/1/card pad.html]]></link><item>
<title><![CDATA[Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Thermal_Management_Materials_3.0W_Silicone--11909846_12019370.html]]></link><description><![CDATA[pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers&apos; requirement-customized
Lead Time :Quantity(Pieces):5000]]></description><pubDate><![CDATA[20241021]]></pubDate></item>
<item>
<title><![CDATA[Laird Tflex 300 Thermal Gap Filler]]></title><link><![CDATA[https://evita0828.en.ec21.com/Laird_Tflex_300_Thermal_Gap--11451854_11452136.html]]></link><description><![CDATA[pad to be reused many times. Laird Tflex 360, in achieving its stellar compliancy, does not sacrifice thermal performance. With a
thermal conductivity of 1.2 W/mK, low thermal resistances can be achi]]></description><pubDate><![CDATA[20230706]]></pubDate></item>

</channel>
</rss>