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<title><![CDATA[EC21 Product Catalogs - conductive form]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/conductive_form--100303/1/conductive form.html]]></link><item>
<title><![CDATA[Soldering Tinned Ring Intermediate Terminal Tinned Heat Shrink Insulated Wire Joiner Connnector]]></title><link><![CDATA[https://keyusce.en.ec21.com/Soldering_Tinned_Ring_Intermediate_Terminal--12062222_12062838.html]]></link><description><![CDATA[forming a firm and low-resistance conductive connection between wires to prevent signal or current loss.
Product Application
The Insulated Terminal is applied for kinds of industrial and mining enter]]></description><pubDate><![CDATA[20260310]]></pubDate></item>
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<title><![CDATA[PCB Lamination Cushion Pad]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/PCB_Lamination_Cushion_Pad--12047095_12047101.html]]></link><description><![CDATA[form and efficient heat - conduction performance, it boosts the production efficiency of high - temperature lamination significantly.
3. Every Lamination Process Materials embodies craftsmanship and ]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Bergquist Liqui Form Tlf 10000]]></title><link><![CDATA[https://evita0828.en.ec21.com/Bergquist_Liqui_Form_Tlf_10000--11451854_11451891.html]]></link><description><![CDATA[FORM TLF 10000 is a thermally conductive, one-part liquid formable gel material.BERGQUIST LIQUI FORM TLF 10000 thermally conductive gel interface material is designed to meet the demanding requiremen]]></description><pubDate><![CDATA[20250208]]></pubDate></item>
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<title><![CDATA[Phenolic Foam Insulation Pipe]]></title><link><![CDATA[https://clearheatinsulation.en.ec21.com/Phenolic_Foam_Insulation_Pipe--12011446_12011449.html]]></link><description><![CDATA[Phenolic Foam Insulation Pipe is a new pipe insulation material formed by cutting. The product has super insulation effect, convenient construction and neat appearance.
The main body of phenolic foam]]></description><pubDate><![CDATA[20240929]]></pubDate></item>
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<title><![CDATA[Factory Cheap Composite Insulation Material]]></title><link><![CDATA[https://yl008.en.ec21.com/Factory_Cheap_Composite_Insulation_Material--11958277_11974680.html]]></link><description><![CDATA[formed by adding special insulation particles to silicone material to foam, forming a uniform, lightweight, and flexible elastic body. It is a thermal insulation gasket material coated with glass fib]]></description><pubDate><![CDATA[20240904]]></pubDate></item>
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<title><![CDATA[Thermal Paste CPU Cooling Thermal Grease for Gaming Laptop/LED/Circuit Board Heat Transfer]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Thermal_Paste_CPU_Cooling_Thermal--11991936_11992734.html]]></link><description><![CDATA[Thermal grease has excellent heat conductive, diversified operations and reliability stable performance, has good wettability on the surface of copper and aluminum. 
Due to the lower viscosity, it ca]]></description><pubDate><![CDATA[20240827]]></pubDate></item>
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<title><![CDATA[Bergquist Hi-flow 565ut]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Hi_flow_565ut--11478029_11554584.html]]></link><description><![CDATA[conductive phase change material which is supplied in an easy to use tabulated pad form. In the application the material undergoes a phase change softening, starting near 52°C. The phase change soft]]></description><pubDate><![CDATA[20240821]]></pubDate></item>
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<title><![CDATA[Ultra Soft Thermal Conductive Silicon Thermal Pad for CPU GPU LED]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Ultra_Soft_Thermal_Conductive_Silicon--11911326_11911351.html]]></link><description><![CDATA[Conductive Materials &amp; Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and m]]></description><pubDate><![CDATA[20240624]]></pubDate></item>
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<title><![CDATA[Thermal Conductive Silicon Thermal Pad 3.0w/M.K Exclusively for CPU 50*50*2mm]]></title><link><![CDATA[https://andychow12.en.ec21.com/Thermal_Conductive_Silicon_Thermal_Pad--10651189_11934116.html]]></link><description><![CDATA[Key Specifications/Special Features:Can be customized to any dimension,and can be smeared with adhesive!It&apos;s made by mixing silicon grease,thermal conductive paste,ZnO,and some other chemical materia]]></description><pubDate><![CDATA[20240509]]></pubDate></item>
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<title><![CDATA[Hot Melt Aluminum Foil Mylar Tape]]></title><link><![CDATA[https://filmtape.en.ec21.com/Hot_Melt_Aluminum_Foil_Mylar--11729864_11729904.html]]></link><description><![CDATA[conductive adhesive (heat sensitive acrylic adhesive)
Adhesion: 1.5 ~ 1.3kg/25mm
Temperature resistance: - 10 ℃ - 120 ℃
Tensile strength: 4.5-4.8kg/mm
Elongation: 7-7% - 3-4%
remarks:
1. The test]]></description><pubDate><![CDATA[20230217]]></pubDate></item>
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<title><![CDATA[Precision of A Die-cutting]]></title><link><![CDATA[https://linh123.en.ec21.com/Precision_of_A_Die_cutting--7688678_7825711.html]]></link><description><![CDATA[Die-cutting is to cut the product into a predetermined shape. The shape is formed by precision machining and cutting to make it customized.
Services: Quick Order Processing Tolerance is controlled wi]]></description><pubDate><![CDATA[20160418]]></pubDate></item>

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