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<title><![CDATA[EC21 Product Catalogs - conductive materials]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/conductive_materials--100303/1/conductive materials.html]]></link><item>
<title><![CDATA[R-Type Intermediate Terminal Block - Universal Wire Connection for Electrical Systems]]></title><link><![CDATA[https://keyusce.en.ec21.com/R_Type_Intermediate_Terminal_Block--12062222_12062572.html]]></link><description><![CDATA[conductive materials, it offers excellent corrosion resistance and long service life, suitable for general electrical wiring projects in homes, offices, and small industrial settings. Easy to install]]></description><pubDate><![CDATA[20260302]]></pubDate></item>
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<title><![CDATA[Thermal Conductive Tape (SSTCT)]]></title><link><![CDATA[https://nguyenlinh678.en.ec21.com/Thermal_Conductive_Tape_SSTCT--11956410_11956871.html]]></link><description><![CDATA[SSTCT Thermal Conductive Type Performance: K value between 0.3~1.0W/mK, the thermally conductive double-sided tape uses glass fiber as the base material. It has
thermal conductivity and ultra-high ad]]></description><pubDate><![CDATA[20250625]]></pubDate></item>
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<title><![CDATA[Laird Tgard 200B]]></title><link><![CDATA[https://evita0828.en.ec21.com/Laird_Tgard_200B--11451854_11452159.html]]></link><description><![CDATA[material and the pad will not dry out, crack, or fail when pressured between mating parts.APPLICATIONS 1.Automotive control units 2.Power conversion equipment 3. Power semiconductors (To packages, M0]]></description><pubDate><![CDATA[20250311]]></pubDate></item>
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<title><![CDATA[PCB Lamination Cushion Pad]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/PCB_Lamination_Cushion_Pad--12047095_12047101.html]]></link><description><![CDATA[materials, it remains as stable as Mount Tai under the severe test of 280°C high temperature, continuously exerting its force. With its uniform and efficient heat - conduction performance, it boosts]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials Laminates/Wave Soldering/Reflow Soldering Pallets Fixtures]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Solder_Pallet_Materials_Laminates_Wave--12036090_12036091.html]]></link><description><![CDATA[materials offer good electrical insulation properties, making them suitable for applications where conductivity needs to be minimized.
Mechanical Strength: T301 is designed to be durable, offering ex]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Pad HC5.0  GAP PADTGP HC5000 BERGQUIST GPHC5.0]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Gap_Pad_HC5.0_GAP--11478029_11481252.html]]></link><description><![CDATA[material is ideal for applications requiring low stress on components and boards during assembly. BERGQUIST GPHC5.0(Thermal Conductive Insulating Silicone Gasket) maintains a conformable nature that ]]></description><pubDate><![CDATA[20241212]]></pubDate></item>
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<title><![CDATA[Solder Pallet Material]]></title><link><![CDATA[https://changdacm.en.ec21.com/Solder_Pallet_Material--5088980_5088981.html]]></link><description><![CDATA[materials are dimensionally stable and retain their flatness through repeated cycling in the PCB assembly process. 
The low thermal conductivity of Solder pallet material ensures optimal thermal dist]]></description><pubDate><![CDATA[20241125]]></pubDate></item>
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<title><![CDATA[Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Thermal_Management_Materials_3.0W_Silicone--11909846_12019370.html]]></link><description><![CDATA[Thermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Transfer
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which ]]></description><pubDate><![CDATA[20241021]]></pubDate></item>
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<title><![CDATA[External Wall Insulation Phenolic Board]]></title><link><![CDATA[https://clearheatinsulation.en.ec21.com/External_Wall_Insulation_Phenolic_Board--12011446_12011447.html]]></link><description><![CDATA[material, such as light weight and convenient construction.
1) Excellent fire resistance performance
Phenolic foam is used as the thermal insulation layer, which is compounded with other materials fo]]></description><pubDate><![CDATA[20240929]]></pubDate></item>
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<title><![CDATA[Factory Cheap Composite Insulation Material]]></title><link><![CDATA[https://yl008.en.ec21.com/Factory_Cheap_Composite_Insulation_Material--11958277_11974680.html]]></link><description><![CDATA[material, it is more convenient to process, has more advantages in price, low heat conduction, outstanding heat insulation effect, soft and excellent mechanical strength, light weight, good elasticit]]></description><pubDate><![CDATA[20240904]]></pubDate></item>
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<title><![CDATA[Thermally Conductive Insulator Silpad BM-K10 Silicone-coated Fiberglass Sheet for Mosfet for IGBT]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Thermally_Conductive_Insulator_Silpad_BM--11869813_11992983.html]]></link><description><![CDATA[BM-K series Insulator silicone Sheet is based upon fiberglass and polyimide as raw materials,also known as thermal conductive silicone cloth,tearing resistant silicone sheet. 
This material can effec]]></description><pubDate><![CDATA[20240827]]></pubDate></item>
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<title><![CDATA[Thermally Conductive Insulator]]></title><link><![CDATA[https://emtron11.en.ec21.com/Thermally_Conductive_Insulator--11931195_11937477.html]]></link><description><![CDATA[PRODUCT INTRODUCTION
Thermally conductive insulator sheet is a heat conducting material 
reinforced by glass fiber or polyimide film. It has the characteristics of 
high insulation, high strength, ul]]></description><pubDate><![CDATA[20240515]]></pubDate></item>
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<title><![CDATA[Thermal Conductive Silicon Thermal Pad 3.0w/M.K Exclusively for CPU 50*50*2mm]]></title><link><![CDATA[https://andychow12.en.ec21.com/Thermal_Conductive_Silicon_Thermal_Pad--10651189_11934116.html]]></link><description><![CDATA[Key Specifications/Special Features:Can be customized to any dimension,and can be smeared with adhesive!It&apos;s made by mixing silicon grease,thermal conductive paste,ZnO,and some other chemical materia]]></description><pubDate><![CDATA[20240509]]></pubDate></item>
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<title><![CDATA[Copper Tape with Non-conductive Adhesive]]></title><link><![CDATA[https://hopelightcn.en.ec21.com/Copper_Tape_with_Non_conductive--11317718_11567419.html]]></link><description><![CDATA[Copper colored duct tape with non-conductive adhesive is made of high-quality acrylic glue and high-quality copper material as carrier. Copper tape with non-conductive adhesive has strong adhesion, g]]></description><pubDate><![CDATA[20220513]]></pubDate></item>
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<title><![CDATA[PE Battery Separator]]></title><link><![CDATA[https://yxmaterial.en.ec21.com/PE_Battery_Separator--11854868_11854874.html]]></link><description><![CDATA[materials used in the dry method are of good fluidity and low molecular weight (ie, simpler raw materials), so the high temperature can only reach 135 degrees (thermal shutdown temperature), and it w]]></description><pubDate><![CDATA[20231016]]></pubDate></item>
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<title><![CDATA[Fiberglass Needle Mat]]></title><link><![CDATA[https://peterinsulation.en.ec21.com/Fiberglass_Needle_Mat--11825679_11825680.html]]></link><description><![CDATA[Material: E-glass fiber
Density: 100-180kg/cbm
Thermal conductivity: 0.030-0.039 W/m.k(25 °C)
Max Temperature: 700 °C
Long term temperature:550°C
Thickness: 3mm-30mm
Width: 0.8-3.6m
Suitable for u]]></description><pubDate><![CDATA[20231101]]></pubDate></item>
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<title><![CDATA[Thermal Insulation Pallet Materials]]></title><link><![CDATA[https://dwcmcoltd.en.ec21.com/Thermal_Insulation_Pallet_Materials--3950532_3950545.html]]></link><description><![CDATA[Thermal/Heat resistant insulation sheet is high-strength, temperature resistant insulation made from composite materials play a very important role in accurate temperature control and energy conserva]]></description><pubDate><![CDATA[20120326]]></pubDate></item>
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<title><![CDATA[Precision of A Die-cutting]]></title><link><![CDATA[https://linh123.en.ec21.com/Precision_of_A_Die_cutting--7688678_7825711.html]]></link><description><![CDATA[Material selection and help procurement
Product Usage: Protection of high temperature and high pressure, shock buffer, electrical and thermal conductivity, shielding, bonding fix, etc...
Product appl]]></description><pubDate><![CDATA[20160418]]></pubDate></item>
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<title><![CDATA[Conductive Cloth Tape]]></title><link><![CDATA[https://filmtape.en.ec21.com/Conductive_Cloth_Tape--11729864_11729899.html]]></link><description><![CDATA[material with superior anti electromagnetic interference ability. Therefore, conductive cloth is widely used in many high-order electronic devices with high added value. It is also widely used to mak]]></description><pubDate><![CDATA[20230217]]></pubDate></item>
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<title><![CDATA[Linerless EPR High Voltage Tape]]></title><link><![CDATA[https://casac1997.en.ec21.com/Linerless_EPR_High_Voltage_Tape--11726544_11736714.html]]></link><description><![CDATA[material
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Linerless tape
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UV-resistance 
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High thermal conductivity
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Excellent weather and moisture resistance. 
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Service temperature: -40℃ to 90℃
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Overload temperature: 130℃ max
l ]]></description><pubDate><![CDATA[20230228]]></pubDate></item>

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