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<title><![CDATA[EC21 Product Catalogs - conductive silicone]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/conductive_silicone--100303/1/conductive silicone.html]]></link><item>
<title><![CDATA[Thermally Conductive Pad (SSTCP)/ Non-Silicone Thermal Pad]]></title><link><![CDATA[https://nguyenlinh678.en.ec21.com/Thermally_Conductive_Pad_SSTCP_Non--11956410_11956411.html]]></link><description><![CDATA[SSTCP series of thermally conductive pad not only has excellent thermal conductivity, but also provides flexibility in the design, compression and viscous choice and reduce the impact on the thermal ]]></description><pubDate><![CDATA[20250625]]></pubDate></item>
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<title><![CDATA[EMI Shielding &amp; Conductive Silicone Rubber Strip]]></title><link><![CDATA[https://tengyexc.en.ec21.com/EMI_Shielding_Conductive_Silicone_Rubber--11829826_12022352.html]]></link><description><![CDATA[电磁干扰 (EMI) 是由电磁波的存在引起的任何电噪声。这种干扰可能会影响电子设备的正常运行。为了减少或消除这种干扰，通常采用电磁屏蔽技术。电]]></description><pubDate><![CDATA[20241105]]></pubDate></item>
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<title><![CDATA[Factory Cheap Thermal Conductive Silicone]]></title><link><![CDATA[https://yl008.en.ec21.com/Factory_Cheap_Thermal_Conductive_Silicone--11958277_11965522.html]]></link><description><![CDATA[Picture instruction :1-single component conductive silicone;2-Two component conductive silicone;3-potting seal silicone compond,4-Thermal conductive silicone grease
Picture1:
Model: YL-1700S series (]]></description><pubDate><![CDATA[20240904]]></pubDate></item>
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<title><![CDATA[Thermally Conductive Insulator Silpad BM-K10 Silicone-coated Fiberglass Sheet for Mosfet for IGBT]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Thermally_Conductive_Insulator_Silpad_BM--11869813_11992983.html]]></link><description><![CDATA[BM-K series Insulator silicone Sheet is based upon fiberglass and polyimide as raw materials,also known as thermal conductive silicone cloth,tearing resistant silicone sheet. 
This material can effec]]></description><pubDate><![CDATA[20240827]]></pubDate></item>
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<title><![CDATA[Ultra Soft Thermal Conductive Silicon Thermal Pad for CPU GPU LED]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Ultra_Soft_Thermal_Conductive_Silicon--11911326_11911351.html]]></link><description><![CDATA[Key attributes:
Construction &amp; CompostionCeramic filled silicone elastomerColourGreySpecific gravity3.0 g/ccThickness0.5mmTHardness75±5 Shore 00Dielectric constant@1MHz5.0 MHzContinuos Use Temp-40 t]]></description><pubDate><![CDATA[20240624]]></pubDate></item>
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<title><![CDATA[Thermal Conductive Silicon Thermal Pad 3.0w/M.K Exclusively for CPU 50*50*2mm]]></title><link><![CDATA[https://andychow12.en.ec21.com/Thermal_Conductive_Silicon_Thermal_Pad--10651189_11934116.html]]></link><description><![CDATA[Key Specifications/Special Features:Can be customized to any dimension,and can be smeared with adhesive!It&apos;s made by mixing silicon grease,thermal conductive paste,ZnO,and some other chemical materia]]></description><pubDate><![CDATA[20240509]]></pubDate></item>
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<title><![CDATA[CPU LED Thermally Conductive Silicone Interface Pad]]></title><link><![CDATA[https://kingheater.en.ec21.com/CPU_LED_Thermally_Conductive_Silicone--6154361_7377451.html]]></link><description><![CDATA[Thermally conductive silicone interface pad silicone heat conductive pad heatconductive slicone interface pad thermal conductive pad Thermal Insulation Soft Silica Gel Tablets Thermally conductive si]]></description><pubDate><![CDATA[20220719]]></pubDate></item>
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<title><![CDATA[Laird Tgard 200B]]></title><link><![CDATA[https://evita0828.en.ec21.com/Laird_Tgard_200B--11451854_11452159.html]]></link><description><![CDATA[silicone/boron nitride composite. These fiberglass-reinforced pads are used when the lowest thermal resistance and high consistent dielectric strength are required. As high-tear, cut-through and punc]]></description><pubDate><![CDATA[20250311]]></pubDate></item>
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<title><![CDATA[PCB Lamination Cushion Pad]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/PCB_Lamination_Cushion_Pad--12047095_12047101.html]]></link><description><![CDATA[silicone pads. The Lamination Process Materials is like a master key, opening the door to high-quality production in numerous industries. In the electronics manufacturing industry, it is the &quot;guardia]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Pad HC5.0  GAP PADTGP HC5000 BERGQUIST GPHC5.0]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Gap_Pad_HC5.0_GAP--11478029_11481252.html]]></link><description><![CDATA[Conductive Insulating Silicone Gasket) maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQU]]></description><pubDate><![CDATA[20241212]]></pubDate></item>
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<title><![CDATA[High Rebound Thermal Pad]]></title><link><![CDATA[https://emtron11.en.ec21.com/High_Rebound_Thermal_Pad--11931195_11937433.html]]></link><description><![CDATA[PRODUCT INTRODUCTION
High rebound thermal pad is a silicone-based thermal interface material with high thermal conductivity and low compression set. 
Low interface thermal resistance can be achieved ]]></description><pubDate><![CDATA[20240515]]></pubDate></item>
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<title><![CDATA[High Conductivity Thermal Graphite Cooling Film]]></title><link><![CDATA[https://filmtape.en.ec21.com/High_Conductivity_Thermal_Graphite_Cooling--11729864_11729878.html]]></link><description><![CDATA[High Conductivity Thermal Graphite Cooling Film
High performance thermal conductive film with thickness up to 0.025mm has better thermal conductivity than thermal conductive silicone grease, which ca]]></description><pubDate><![CDATA[20230217]]></pubDate></item>
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<title><![CDATA[Black Polyester Tape]]></title><link><![CDATA[https://hopelightcn.en.ec21.com/Black_Polyester_Tape--11317718_11317725.html]]></link><description><![CDATA[silicone gel. Black polyester tape is insulated and high temperature resistant, with a transparent release film is optional. Black polyester tape
thickness and width is customizable and can be proces]]></description><pubDate><![CDATA[20210105]]></pubDate></item>

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