EC21 Product Catalogs - d150

Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer

20241021

D150Thermal Conductivity3.0W/mKASTM D5470Volume Resistivity1.0X10¹² Ohm-meterASTM D257Hardness35 Shore 00ASTM 2240Continuous Use Temp–40 ~160 ℃**********Specific Gravity3.0 g/ccASTM D297Outgass

Bergquist Gap Pad Tgp 12000ulm

20240712

D150, 1,000Hz 8.4 Dielectric Breakdown Voltage: 0.04 inch sample, VAC 6,200 Thermal Properties Thermal Conductivity, ASTM D5470, W/(m-K) 12Material solutions for cloud recommends BERGQUIST GAP PAD TG

Bergquist Gap Pad Tgp 7000ulm

20231113

ASTM D150, 1,000Hz 8.7Dielectric Breakdown Voltage : 40 mil sample, VAC >5,000Volume Resistivity, ASTM D257, ohm-meter 1.2×1011 Thermal Properties Thermal Conductivity, ASTM D5470, W/(m-K) 7.0

CPU LED Thermally Conductive Silicone Interface Pad

20220719

D150 Weight Daminify --- <=0.3% at 150C 240H Flame Rating --- V-0 UL 94 Thermal Conductivity W/m.k 3.0 ASTM E1461 UL, RoHS, REACH --- Compliance --- Sheet sizes: Standard sheet size:200*400mm;Custom