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<title><![CDATA[EC21 Product Catalogs - flat pad]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/flat_pad--100303/1/flat pad.html]]></link><item>
<title><![CDATA[PCB Lamination Process Materials Press Pad Cushion]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/PCB_Lamination_Process_Materials_Press--12047095_12047252.html]]></link><description><![CDATA[pad materials, it remains as stable as Mount Tai under the severe test of 280°C high temperature, continuously exerting its force. With its uniform and efficient heat - conduction performance, it bo]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[High Rebound Thermal Pad]]></title><link><![CDATA[https://emtron11.en.ec21.com/High_Rebound_Thermal_Pad--11931195_11937433.html]]></link><description><![CDATA[PRODUCT INTRODUCTION
High rebound thermal pad is a silicone-based thermal interface material with high thermal conductivity and low compression set. 
Low interface thermal resistance can be achieved ]]></description><pubDate><![CDATA[20240515]]></pubDate></item>

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