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<title><![CDATA[EC21 Product Catalogs - good conductivity]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/good_conductivity--100303/1/good conductivity.html]]></link><item>
<title><![CDATA[Quick-Install Anti-Corrosion Y Style Junction Terminal No Splicing Needed for Efficient Wiring]]></title><link><![CDATA[https://keyusce.en.ec21.com/Quick_Install_Anti_Corrosion_Y--12062222_12062579.html]]></link><description><![CDATA[Good electrical conductivity.
5, High elasticity, tube is not easy to deformation.
Technical parameters
Product dimension
Special size, special color, etc, can be customized according to customer&apos;s r]]></description><pubDate><![CDATA[20260302]]></pubDate></item>
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<title><![CDATA[Thermally Conductive Pad (SSTCP)/ Non-Silicone Thermal Pad]]></title><link><![CDATA[https://nguyenlinh678.en.ec21.com/Thermally_Conductive_Pad_SSTCP_Non--11956410_11956411.html]]></link><description><![CDATA[good thermal conductivityExtra soft &amp; high compressive strengthHigh electrical voltage resistanceEasy to assemblingApplications：
Computer Service：CPU, Heat Sink, Memory modulesLED Light LCD-TV Te]]></description><pubDate><![CDATA[20250625]]></pubDate></item>
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<title><![CDATA[280 Celsius Hard Laminated Cushion]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/280_Celsius_Hard_Laminated_Cushion--12047095_12047251.html]]></link><description><![CDATA[good heat - conduction performance and uniform heat transfer, which improves the production efficiency of high - temperature lamination.
During the production process, the lamination cushion undergoe]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials Laminates/Wave Soldering/Reflow Soldering Pallets Fixtures]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Solder_Pallet_Materials_Laminates_Wave--12036090_12036091.html]]></link><description><![CDATA[good electrical insulation properties, making them suitable for applications where conductivity needs to be minimized.
Mechanical Strength: T301 is designed to be durable, offering excellent mechanic]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
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<title><![CDATA[Durostone Materials]]></title><link><![CDATA[https://changdacm.en.ec21.com/Durostone_Materials--5088980_5350308.html]]></link><description><![CDATA[conductivity.Excellent machining properties enabling the manufacture of complex design solder pallets.Good resistance to chemicals used in modern fluxes.
According to the market requirement,we have d]]></description><pubDate><![CDATA[20241125]]></pubDate></item>
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<title><![CDATA[Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Thermal_Management_Materials_3.0W_Silicone--11909846_12019370.html]]></link><description><![CDATA[Conductivity3.0W/mKASTM D5470Volume Resistivity1.0X10¹² Ohm-meterASTM D257Hardness35 Shore 00ASTM 2240Continuous Use Temp–40 ~160 ℃**********Specific Gravity3.0 g/ccASTM D297Outgassing (TML)0.4]]></description><pubDate><![CDATA[20241021]]></pubDate></item>
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<title><![CDATA[External Wall Insulation Phenolic Board]]></title><link><![CDATA[https://clearheatinsulation.en.ec21.com/External_Wall_Insulation_Phenolic_Board--12011446_12011447.html]]></link><description><![CDATA[good insulation performance, with a thermal conductivity of about 0.020~0.025W/(m·k), which is far lower than commonly used inorganic and organic exterior wall insulation products in the market, and]]></description><pubDate><![CDATA[20240929]]></pubDate></item>
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<title><![CDATA[Factory Cheap Composite Insulation Material]]></title><link><![CDATA[https://yl008.en.ec21.com/Factory_Cheap_Composite_Insulation_Material--11958277_11974680.html]]></link><description><![CDATA[conduction, outstanding heat insulation effect, soft and excellent mechanical strength, light weight, good elasticity, and has sealing and buffering effect
Application scope: Insulation for high-spee]]></description><pubDate><![CDATA[20240904]]></pubDate></item>
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<title><![CDATA[Thermally Conductive Insulator Silpad BM-K10 Silicone-coated Fiberglass Sheet for Mosfet for IGBT]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Thermally_Conductive_Insulator_Silpad_BM--11869813_11992983.html]]></link><description><![CDATA[good electrical insulation, high dielectric strength, good thermal conductivity performance.It can resist high voltage and metal parts pierced problem lead to 
a short circuit, it&apos;s a good thermal in]]></description><pubDate><![CDATA[20240827]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Filler Tgf 2000 GF2000]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Gap_Filler_Tgf_2000--11478029_11481206.html]]></link><description><![CDATA[Features and Benefits 1. Thermal conductivity: 2.0 W/m-K2. Ultra-conforming; designed for fragile and low-stress applications 3.Ambient and accelerated cure schedules 4.100% solids – no cure by-pro]]></description><pubDate><![CDATA[20240709]]></pubDate></item>
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<title><![CDATA[High Rebound Thermal Pad]]></title><link><![CDATA[https://emtron11.en.ec21.com/High_Rebound_Thermal_Pad--11931195_11937433.html]]></link><description><![CDATA[Good thermal conductivity and low thermal resistance
• Soft, low stress, good filling effect and no damage to components
• High strength, high rebound, and super reliability
TYPICAL APPLICATION
]]></description><pubDate><![CDATA[20240515]]></pubDate></item>
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<title><![CDATA[Silicone Thermal Insulation Film Exclusively for Power 18220.3mm To-3P1 1000pc]]></title><link><![CDATA[https://andychow12.en.ec21.com/Silicone_Thermal_Insulation_Film_Exclusively--10651189_11933654.html]]></link><description><![CDATA[Product description:
Insulation,cooling, fire prevention, shock absorption, tensile resistance, abrasion resistance, good insulation properties, high thermal conductivity, high resistance to voltage,]]></description><pubDate><![CDATA[20240508]]></pubDate></item>
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<title><![CDATA[Braided Heat Shrinkable Sleeve and Non Heat Shrink Self-closing Wrap for Automobile Industry]]></title><link><![CDATA[https://upolymer.en.ec21.com/Braided_Heat_Shrinkable_Sleeve_and--9588196_9588204.html]]></link><description><![CDATA[good abrasion resistance, fire resistance and heat dissipation. It is used to provide anti-wear protection and noise suppression; the open structure is convenient for the maintenance, maintenance, mo]]></description><pubDate><![CDATA[20240403]]></pubDate></item>
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<title><![CDATA[Hot Melt Aluminum Foil Mylar Tape]]></title><link><![CDATA[https://filmtape.en.ec21.com/Hot_Melt_Aluminum_Foil_Mylar--11729864_11729904.html]]></link><description><![CDATA[good shielding effect for electromagnetic radiation interference and good performance for grounding electrostatic discharge. At the same time, this product is also used for soldering tin,
Parameters:]]></description><pubDate><![CDATA[20230217]]></pubDate></item>
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<title><![CDATA[Copper Tape]]></title><link><![CDATA[https://hopelightcn.en.ec21.com/Copper_Tape--11317718_11317730.html]]></link><description><![CDATA[good electrical conductivity, strong sealing performance, easy to fit, anti-aging. The copper foil shielding tape can be used in twists and turns, and can be cut in various specifications.
Hopelight ]]></description><pubDate><![CDATA[20210105]]></pubDate></item>
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<title><![CDATA[PE Battery Separator]]></title><link><![CDATA[https://yxmaterial.en.ec21.com/PE_Battery_Separator--11854868_11854874.html]]></link><description><![CDATA[conductivity, allowing for efficient and rapid transport of lithium ions between the electrodes. This facilitates improved battery performance, including higher power output, faster charging, and inc]]></description><pubDate><![CDATA[20231016]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials]]></title><link><![CDATA[https://dwcmcoltd.en.ec21.com/Solder_Pallet_Materials--3950532_3950533.html]]></link><description><![CDATA[conductivity of the durotone prevents heat-shrinkage of the bas board, to ensure the quality of reflow process. It is designed and typically recommended for use in manufacturing solder pallets for wa]]></description><pubDate><![CDATA[20120409]]></pubDate></item>

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