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<title><![CDATA[EC21 Product Catalogs - heat conduction]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/heat_conduction--100303/1/heat conduction.html]]></link><item>
<title><![CDATA[Factory Direct Sale 1.5-15W/M.K Thermal Conductive Silicone Pad for LED/LCD/CPU Heat Transfer]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Factory_Direct_Sale_1.5_15W--11869794_11992205.html]]></link><description><![CDATA[heat sink, the direct contact area between the two is limited, and the conduction efficiency of heat is therefore limited. 
It is by filling these gaps that the thermal conductive silicone pad increa]]></description><pubDate><![CDATA[20240826]]></pubDate></item>
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<title><![CDATA[High Temperature Double Sided Adhesive Conductive Tape Thermal Transfer LED Lighting Heat Conductive]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/High_Temperature_Double_Sided_Adhesive--11935710_11935784.html]]></link><description><![CDATA[High Temperature Double Sided Adhesive Conductive Tape Thermal Transfer LED Lighting Heat Conductive
The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors]]></description><pubDate><![CDATA[20240513]]></pubDate></item>
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<title><![CDATA[C106 Semi-Conductive/Insulation/Elastomeric Insulation Tri-Layer Heat Shrink Tube]]></title><link><![CDATA[https://upolymer.en.ec21.com/C106_Semi_Conductive_Insulation_Elastomeric--1688950_9588219.html]]></link><description><![CDATA[C106 Semi-Conductive/Insulation/Elastomeric Insulation Tri-Layer Heat Shrink Tube
Features
Cross-linked heavy wall tubing 
Operating temperature: -55~105℃
Tri-layer design with high recovery forces]]></description><pubDate><![CDATA[20150715]]></pubDate></item>
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<title><![CDATA[Soldering Tinned Ring Intermediate Terminal Tinned Heat Shrink Insulated Wire Joiner Connnector]]></title><link><![CDATA[https://keyusce.en.ec21.com/Soldering_Tinned_Ring_Intermediate_Terminal--12062222_12062838.html]]></link><description><![CDATA[heated, forming a firm and low-resistance conductive connection between wires to prevent signal or current loss.
Product Application
The Insulated Terminal is applied for kinds of industrial and mini]]></description><pubDate><![CDATA[20260310]]></pubDate></item>
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<title><![CDATA[Thermally Conductive Pad (SSTCP)/ Non-Silicone Thermal Pad]]></title><link><![CDATA[https://nguyenlinh678.en.ec21.com/Thermally_Conductive_Pad_SSTCP_Non--11956410_11956411.html]]></link><description><![CDATA[conductivity, but also provides flexibility in the design, compression and viscous choice and reduce the impact on the thermal resistance of the air, easy to use, installed between the heating elemen]]></description><pubDate><![CDATA[20250625]]></pubDate></item>
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<title><![CDATA[PCB Lamination Cushion Pad]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/PCB_Lamination_Cushion_Pad--12047095_12047101.html]]></link><description><![CDATA[heat - conduction performance, it boosts the production efficiency of high - temperature lamination significantly.
3. Every Lamination Process Materials embodies craftsmanship and sweat. The repeated]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Bergquist Liqui Form Tlf 10000]]></title><link><![CDATA[https://evita0828.en.ec21.com/Bergquist_Liqui_Form_Tlf_10000--11451854_11451891.html]]></link><description><![CDATA[Features and benefits Thermal conductivity: 10 W/m-K Dispensable pre-cured gel Stable viscosity in storage and in applications Excellent chemical stability and mechanical stability
BERGQUIST LIQUI FO]]></description><pubDate><![CDATA[20250208]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials Laminates/Wave Soldering/Reflow Soldering Pallets Fixtures]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Solder_Pallet_Materials_Laminates_Wave--12036090_12036091.html]]></link><description><![CDATA[heat is a critical factor.
Electrical Insulation: These materials offer good electrical insulation properties, making them suitable for applications where conductivity needs to be minimized.
Mechanic]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
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<title><![CDATA[Durostone Materials]]></title><link><![CDATA[https://changdacm.en.ec21.com/Durostone_Materials--5088980_5350308.html]]></link><description><![CDATA[conductivity of the durostone prevents heat-shrinkage of the base board, to ensure the quality of reflow process.
Durostone materials have been developed for all procedures within the PCB assembly pr]]></description><pubDate><![CDATA[20241125]]></pubDate></item>
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<title><![CDATA[Phenolic Floor Insulation]]></title><link><![CDATA[https://clearheatinsulation.en.ec21.com/Phenolic_Floor_Insulation--12011446_12011455.html]]></link><description><![CDATA[heating systems.
First of all, the thermal conductivity of phenolic insulation board
is as low as 0.021W/m·K, Phenolic insulation board has the same R-value and thermal insulation effect as PIR mate]]></description><pubDate><![CDATA[20240929]]></pubDate></item>
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<title><![CDATA[Factoy Cheap Thermal Conductive Pad/Sheet Thermal Silicon Pad Silicon Pad]]></title><link><![CDATA[https://yl008.en.ec21.com/Factoy_Cheap_Thermal_Conductive_Pad--11958277_11958302.html]]></link><description><![CDATA[Brand Name: Yuling 
Model Number: Customized 
Application: High Temperature,Heat Sink,CPU,GPU Specific 
Gravity: 2.2g/cm3 
Sample: Free 
Flammability: UL94V-0 
Thickness: 0.3~15mm 
Size: Customizable]]></description><pubDate><![CDATA[20240904]]></pubDate></item>
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<title><![CDATA[Bergquist Hi-flow 565ut]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Hi_flow_565ut--11478029_11554584.html]]></link><description><![CDATA[BERGQUIST HI-FLOW THF 3000UT Features and Benefits• Thermal impedance: 0.05°C-in.2/W(at 25 psi)• High thermal conductivity: 3.0 W/mk• Phase change softening temperature52°C• Naturally tacky]]></description><pubDate><![CDATA[20240821]]></pubDate></item>
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<title><![CDATA[Phase-change Materials]]></title><link><![CDATA[https://emtron11.en.ec21.com/Phase_change_Materials--11931195_11937488.html]]></link><description><![CDATA[heat source and the radiator. Compared with conventional heat 
conducting materials, the phase change material has better wettability, lower contact thermal resistance and better heat dissipation.
PR]]></description><pubDate><![CDATA[20240515]]></pubDate></item>
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<title><![CDATA[Thermal Conductive Silicon Thermal Pad 3.0w/M.K Exclusively for CPU 50*50*2mm]]></title><link><![CDATA[https://andychow12.en.ec21.com/Thermal_Conductive_Silicon_Thermal_Pad--10651189_11934116.html]]></link><description><![CDATA[structure not only make the pad with strong heat absorbing ability,also with the initiative heat conduction function,when filling into the gap between heating device and heatsink or metab.
]]></description><pubDate><![CDATA[20240509]]></pubDate></item>
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<title><![CDATA[Conductive Cloth Tape]]></title><link><![CDATA[https://filmtape.en.ec21.com/Conductive_Cloth_Tape--11729864_11729899.html]]></link><description><![CDATA[conductive foam, anti electromagnetic wave for communication equipment, which can withstand high temperature up to 200 ° C. It is suitable for power supply, high power transistor and heat sink, inte]]></description><pubDate><![CDATA[20230217]]></pubDate></item>
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<title><![CDATA[Linerless EPR High Voltage Tape]]></title><link><![CDATA[https://casac1997.en.ec21.com/Linerless_EPR_High_Voltage_Tape--11726544_11736714.html]]></link><description><![CDATA[conductivity
l 
Excellent weather and moisture resistance. 
l 
Service temperature: -40℃ to 90℃
l 
Overload temperature: 130℃ max
l 
Color: black
Technical properties: 
Property
Test Method
Typ]]></description><pubDate><![CDATA[20230228]]></pubDate></item>
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<title><![CDATA[Aluminum Foil Tape]]></title><link><![CDATA[https://hopelightcn.en.ec21.com/Aluminum_Foil_Tape--11317718_11317721.html]]></link><description><![CDATA[conductive high temperature aluminum tape means double-sided conductive. In addition to aluminum foil tape, there is also duck aluminum foil tape
.
As a kind of heat resistant aluminium foil tape, th]]></description><pubDate><![CDATA[20210105]]></pubDate></item>
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<title><![CDATA[PE Battery Separator]]></title><link><![CDATA[https://yxmaterial.en.ec21.com/PE_Battery_Separator--11854868_11854874.html]]></link><description><![CDATA[heated, and Safety is not suitable for high-power, high-capacity batteries; dry method can do three-layer film, the advantage of three-layer film is that the thermal shutdown temperature is 135 degre]]></description><pubDate><![CDATA[20231016]]></pubDate></item>
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<title><![CDATA[Thermal Insulation Pallet Materials]]></title><link><![CDATA[https://dwcmcoltd.en.ec21.com/Thermal_Insulation_Pallet_Materials--3950532_3950545.html]]></link><description><![CDATA[request. 
-High temperature resistance: operating temperature up to 300 degree - Less distortion - Superior dimensional stability.
-Low heat conductivity
-Higher thermoforming stability
]]></description><pubDate><![CDATA[20120326]]></pubDate></item>
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<title><![CDATA[Thermally Conductive Silicone Interface Pad]]></title><link><![CDATA[https://kingheater.en.ec21.com/Thermally_Conductive_Silicone_Interface_Pad--6154361_7377419.html]]></link><description><![CDATA[Thermally conductive silicone interface pad silicone heat conductive pad heatconductive slicone interface pad thermal conductive pad Thermal Insulation Soft Silica Gel Tablets Thermally conductive si]]></description><pubDate><![CDATA[20220719]]></pubDate></item>
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<title><![CDATA[Thermal Conductive MT Polyimide Film]]></title><link><![CDATA[https://polyimidefilm.en.ec21.com/Thermal_Conductive_MT_Polyimide_Film--10664508_11556328.html]]></link><description><![CDATA[Thermal Conductive MT polyimide film series is enhanced with thermal conductivity properties,
it posses excellent thermal conductivity, which provides an ideal heat conduction and control programs to]]></description><pubDate><![CDATA[20220420]]></pubDate></item>

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