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<title><![CDATA[EC21 Product Catalogs - heat sensitive changing]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/heat_sensitive_changing--100303/1/heat sensitive changing.html]]></link><item>
<title><![CDATA[NAS630 Hardening Steel Separator Plate]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/NAS630_Hardening_Steel_Separator_Plate--12047103_12047192.html]]></link><description><![CDATA[sensitive application fields such as aerospace and automotive.
· The resin matrix and reinforcing materials of NAS630 steel plate have high fatigue resistance. During the lamination process, the NAS]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials Laminates/Wave Soldering/Reflow Soldering Pallets Fixtures]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Solder_Pallet_Materials_Laminates_Wave--12036090_12036091.html]]></link><description><![CDATA[Heat Insulation Boards: T301 is often used in insulating boards to protect sensitive electronics from heat exposure during assembly and testing processes.
Electronics Assembly: T301 is also used in v]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
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<title><![CDATA[Graphite Synthetic Film 6w/Mk Thermal Conductivity for Mobil Phone]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Graphite_Synthetic_Film_6w_Mk--11939981_11940033.html]]></link><description><![CDATA[heat conduction function is attained.
Features
&gt; Easy to assemble
&gt; Ultra-thin type
&gt; RoHS Compliant
&gt; Thermal Conductivity: 240 to 1700W/mK
&gt; Reduce hot spots and protect sensitive areas
&gt; Light wei]]></description><pubDate><![CDATA[20240520]]></pubDate></item>
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<title><![CDATA[Bergquist Hi Flow Thf 500 Hi-Flow 625]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Hi_Flow_Thf_500--11478029_11501012.html]]></link><description><![CDATA[change compound coated on PEN film. 
BERGQUIST HF625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.
The rei]]></description><pubDate><![CDATA[20240514]]></pubDate></item>

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