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<title><![CDATA[EC21 Product Catalogs - heating board]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/heating_board--100303/1/heating board.html]]></link><item>
<title><![CDATA[Thermal Paste CPU Cooling Thermal Grease for Gaming Laptop/LED/Circuit Board Heat Transfer]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Thermal_Paste_CPU_Cooling_Thermal--11991936_11992734.html]]></link><description><![CDATA[heating spare parts;
5.LED lamp, power supply, UPS power supply etc.;
6.Power semiconductor, fever transistor and MOSFET;
7.Monitor, communication equipments and other consumer electronic products.
F]]></description><pubDate><![CDATA[20240827]]></pubDate></item>
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<title><![CDATA[4:1  Heat Shrink Tubing 260C High Temperature PTFE  Flexible Heat Shrink Tubing Wrap Wire]]></title><link><![CDATA[https://keyusce.en.ec21.com/4_1_Heat_Shrink_Tubing--12059644_12060792.html]]></link><description><![CDATA[board protection in high-temperature or harsh chemical environments.Aerospace field: It is used for insulation and protection in extreme environments, such as the insulation of heating elements and j]]></description><pubDate><![CDATA[20260128]]></pubDate></item>
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<title><![CDATA[Double Sided Glass Cloth Tape]]></title><link><![CDATA[https://hhaotape.en.ec21.com/Double_Sided_Glass_Cloth_Tape--12020685_12048791.html]]></link><description><![CDATA[Introduce (insert product title here)
Double Sided Glass Cloth Tape
Double Sided Glass Cloth Tape is manufactured from heat resistant
fiberglass cloth with a high temperature silicone adhesive on bot]]></description><pubDate><![CDATA[20250313]]></pubDate></item>
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<title><![CDATA[Glass Cloth Tape]]></title><link><![CDATA[https://citchem.en.ec21.com/Glass_Cloth_Tape--5741528_7290370.html]]></link><description><![CDATA[Manufactured from heat resistant fiberglass cloth
with high performance silicon adhesive on both
sides. For masking uses in high temperature
metalizing or plasma-spray coating processes.
An excellent]]></description><pubDate><![CDATA[20250310]]></pubDate></item>
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<title><![CDATA[PCB Lamination Cushion Pad]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/PCB_Lamination_Cushion_Pad--12047095_12047101.html]]></link><description><![CDATA[boards, door interior panels, etc., it provides precise buffering, resists heat and prevents wrinkling, making the automotive interior extremely delicate and enhancing the overall grade of the vehicl]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Wave/Reflow Soldering Pallet Materials]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Wave_Reflow_Soldering_Pallet_Materials--12036090_12036092.html]]></link><description><![CDATA[TFUER-T315
* Solder Pallet Materials
T315 is a high-performance composite material commonly used as a solder pallet in printed circuit board (PCB) manufacturing processes. It is made of a blend of th]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
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<title><![CDATA[Durostone Materials]]></title><link><![CDATA[https://changdacm.en.ec21.com/Durostone_Materials--5088980_5350308.html]]></link><description><![CDATA[heat-shrinkage of the base board, to ensure the quality of reflow process.
Durostone materials have been developed for all procedures within the PCB assembly process. There are three main grades whic]]></description><pubDate><![CDATA[20241125]]></pubDate></item>
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<title><![CDATA[Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Thermal_Management_Materials_3.0W_Silicone--11909846_12019370.html]]></link><description><![CDATA[board/mother board
● notebook
● power supply
● Heat pipe thermal solutions
● Memory Modules
● Mass storage devices
● Automotive electronics
Typical Properties of TIF100-30-05E
ColorBlueVi]]></description><pubDate><![CDATA[20241021]]></pubDate></item>
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<title><![CDATA[Insulation Fiberglass Sleeving]]></title><link><![CDATA[https://junzhangtrade.en.ec21.com/Insulation_Fiberglass_Sleeving--2254725_8939369.html]]></link><description><![CDATA[board slot wedge 
5.Epoxy sheets 
6. Heat-shrinkable tubing 
If you are interested in them,pls. let us know freely.
Your early reply will be highly appreciated.
Best regards!
John Zhang
chizhouinc(at]]></description><pubDate><![CDATA[20241015]]></pubDate></item>
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<title><![CDATA[Phenolic Floor Insulation]]></title><link><![CDATA[https://clearheatinsulation.en.ec21.com/Phenolic_Floor_Insulation--12011446_12011455.html]]></link><description><![CDATA[When it comes to the choice of floor heating insulation materials
, phenolic insulation boards are gradually becoming the first choice in the market due to their excellent performance. Compared with ]]></description><pubDate><![CDATA[20240929]]></pubDate></item>
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<title><![CDATA[Loctite 315]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Loctite_315--11478029_11546533.html]]></link><description><![CDATA[heat generating electronic components to printed circuit board assemblies or heat sinks. In high pot applications this product should be limited to a maximum of 500 volts. Activator 7387 is required ]]></description><pubDate><![CDATA[20240729]]></pubDate></item>
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<title><![CDATA[Bergquist GPHC3.0 Gap Pad  Hc 3.0 Gap Pad Tgp HC3000]]></title><link><![CDATA[https://evita0828.en.ec21.com/Bergquist_GPHC3.0_Gap_Pad_Hc--11451854_11451865.html]]></link><description><![CDATA[boards during assembly. 
BERGQUIST GPHC3.0 maintains a conformablenature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography.
]]></description><pubDate><![CDATA[20240712]]></pubDate></item>
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<title><![CDATA[Product Description  Insulation Pressboard Presspaper Insulated Paper for Transformer Insulation Gra]]></title><link><![CDATA[https://ydjycl.en.ec21.com/Product_Description_Insulation_Pressboard_Presspaper--11947554_11947665.html]]></link><description><![CDATA[heat resistance and good voltage characteristic.
Crepe kraft paper are ideally suited to insulate irregular shapes and surfaces where a proper insulation can not be reached with flat papers. Specialt]]></description><pubDate><![CDATA[20240605]]></pubDate></item>
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<title><![CDATA[Mica Sheet]]></title><link><![CDATA[https://micamaker.en.ec21.com/Mica_Sheet--3628114_3628115.html]]></link><description><![CDATA[This company produces the HM-S series of heat-resistant mica mica plate is high-quality raw materials and the use of high-performance silicone resin melt by baking the plate suppressed by high-temper]]></description><pubDate><![CDATA[20090625]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials]]></title><link><![CDATA[https://dwcmcoltd.en.ec21.com/Solder_Pallet_Materials--3950532_3950533.html]]></link><description><![CDATA[heat-shrinkage of the bas board, to ensure the quality of reflow process. It is designed and typically recommended for use in manufacturing solder pallets for wave-solder applications of printed circ]]></description><pubDate><![CDATA[20120409]]></pubDate></item>
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<title><![CDATA[Black Kapton Tape]]></title><link><![CDATA[https://hopelightcn.en.ec21.com/Black_Kapton_Tape--11317718_11317724.html]]></link><description><![CDATA[board reflow soldering and fixing.
The use of motors, motors and other electronic products will generate heat energy during operation, this tape can withstand high temperature 260C, Black kapton tape]]></description><pubDate><![CDATA[20210105]]></pubDate></item>
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<title><![CDATA[Replace NOMEX T-410 Insulation Paper; Voice Coil NSV Asbestos Paper X-FIPER Meta Aramid Fiber Insul]]></title><link><![CDATA[https://411327197303110019.en.ec21.com/Replace_NOMEX_T_410_Insulation--11582926_11800403.html]]></link><description><![CDATA[As a kind of heat resistant insulating paper, X-FIPER Meta Aramid Fiber is mainly composed of the polyisophthaloyl metaphenylene diamine fiber. The variety of laminates processed from the X-FIPER ins]]></description><pubDate><![CDATA[20230601]]></pubDate></item>

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