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<title><![CDATA[EC21 Product Catalogs - high low pressure assembly]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/high_low_pressure_assembly--100303/1/high low pressure assembly.html]]></link><item>
<title><![CDATA[Bergquist Liqui Form Tlf 10000]]></title><link><![CDATA[https://evita0828.en.ec21.com/Bergquist_Liqui_Form_Tlf_10000--11451854_11451891.html]]></link><description><![CDATA[wireless in telecom wireless infrastructure Filling various gaps between heat-generating devices to heat sink Devices requiring low assembly pressure High value assemblies where rework is required
]]></description><pubDate><![CDATA[20250208]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Pad HC5.0  GAP PADTGP HC5000 BERGQUIST GPHC5.0]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Gap_Pad_HC5.0_GAP--11478029_11481252.html]]></link><description><![CDATA[low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. BERGQUIS]]></description><pubDate><![CDATA[20241212]]></pubDate></item>
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<title><![CDATA[Factory Direct Sale TO-220 Thermal Conductive Insulator Silicone Cap for Transistor Tube Application]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Factory_Direct_Sale_TO_220--11992662_11992683.html]]></link><description><![CDATA[high thermal conductivity, insulation, shockproof and convenient assembly, etc., are widely used in heat transistor, diode, triode. 
When you use, you can directly installed on the heating pipe. Ther]]></description><pubDate><![CDATA[20240827]]></pubDate></item>

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