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<title><![CDATA[EC21 Product Catalogs - hot pad]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/hot_pad--100303/1/hot pad.html]]></link><item>
<title><![CDATA[280 Celsius Hard Laminated Cushion]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/280_Celsius_Hard_Laminated_Cushion--12047095_12047251.html]]></link><description><![CDATA[hot - pressing process.
Component 
The high temperature resistant buffer pad is made of high elastic fiber, anti-stick high temperature resistant reinforcing material and high molecular polymer. It h]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Filler Tgf 2000 GF2000]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Gap_Filler_Tgf_2000--11478029_11481206.html]]></link><description><![CDATA[hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won’t pump from the interface as a resul]]></description><pubDate><![CDATA[20240709]]></pubDate></item>
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<title><![CDATA[Graphite Synthetic Film 6w/Mk Thermal Conductivity for Mobil Phone]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Graphite_Synthetic_Film_6w_Mk--11939981_11940033.html]]></link><description><![CDATA[hot spots and protect sensitive areas
&gt; Light weight
&gt; Flexible
&gt; Ease of manufacturing for high volume production
&gt; High thermal conductive of 6.0 W/mK
&gt; Low thermal resistanc
Applications
&gt; PDP,LCD]]></description><pubDate><![CDATA[20240520]]></pubDate></item>

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