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<title><![CDATA[EC21 Product Catalogs - or sink]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/or_sink--100303/1/or sink.html]]></link><item>
<title><![CDATA[Bergquist Liqui Form Tlf 10000]]></title><link><![CDATA[https://evita0828.en.ec21.com/Bergquist_Liqui_Form_Tlf_10000--11451854_11451891.html]]></link><description><![CDATA[or refrigeration. Typical applications RRU/AAU/BBU in wireless in telecom wireless infrastructure Filling various gaps between heat-generating devices to heat sink Devices requiring low assembly pres]]></description><pubDate><![CDATA[20250208]]></pubDate></item>
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<title><![CDATA[Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Thermal_Management_Materials_3.0W_Silicone--11909846_12019370.html]]></link><description><![CDATA[Thermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Transfer
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which ]]></description><pubDate><![CDATA[20241021]]></pubDate></item>
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<title><![CDATA[Factory Direct Sale 1.5-15W/M.K Thermal Conductive Silicone Pad for LED/LCD/CPU Heat Transfer]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Factory_Direct_Sale_1.5_15W--11869794_11992205.html]]></link><description><![CDATA[or gaps between the surface of electronic component and the heat sink, the direct contact area between the two is limited, and the conduction efficiency of heat is therefore limited. 
It is by fillin]]></description><pubDate><![CDATA[20240826]]></pubDate></item>
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<title><![CDATA[Bergquist Hi-flow 565ut]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Hi_flow_565ut--11478029_11554584.html]]></link><description><![CDATA[sink• Processor die to lid or heat sink• FBDIMM to heat spreaderConfigurations Available:• Tabulated in roll form, kiss-cut parts – no holes• BERGQUIST HF565UT is limited to a square or r]]></description><pubDate><![CDATA[20240821]]></pubDate></item>
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<title><![CDATA[Thermally Conductive Pad Silicone Gap Filler]]></title><link><![CDATA[https://kingheater.en.ec21.com/Thermally_Conductive_Pad_Silicone_Gap--6154361_7377423.html]]></link><description><![CDATA[sink pad Heat Dissipation pad Thermal Dissipation pad
Properties Units K300 Test Method
Construction &amp; Composition --- Silicone &amp; Ceramic filled ---
Color --- Light Blue Visual
Thickness Range mm 0.5]]></description><pubDate><![CDATA[20220719]]></pubDate></item>
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<title><![CDATA[Conductive Cloth Tape]]></title><link><![CDATA[https://filmtape.en.ec21.com/Conductive_Cloth_Tape--11729864_11729899.html]]></link><description><![CDATA[Conductive Cloth Tape Polyester Fiber Cloth Tape
It is made of high strength polyester fiber cloth coated with gold, silver, copper or nickel, and then coated with high conductivity acrylic pressure-]]></description><pubDate><![CDATA[20230217]]></pubDate></item>

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