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<title><![CDATA[EC21 Product Catalogs - padding filling]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/padding_filling--100303/1/padding filling.html]]></link><item>
<title><![CDATA[BERGQUIST GP2500S20 Gap Pad 2500S20  GAP PAD TGP 2400]]></title><link><![CDATA[https://evita0828.en.ec21.com/BERGQUIST_GP2500S20_Gap_Pad_2500S20--11451854_11451877.html]]></link><description><![CDATA[filled-polymer material yielding extremely soft,elastic characteristics.The material is reinforced to provide easy handling,converting,addedelectrical isolation and tear resistance.BERGQUIST Gap Pad ]]></description><pubDate><![CDATA[20241212]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Pad HC5.0  GAP PADTGP HC5000 BERGQUIST GPHC5.0]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Gap_Pad_HC5.0_GAP--11478029_11481252.html]]></link><description><![CDATA[BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal perfor]]></description><pubDate><![CDATA[20241212]]></pubDate></item>
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<title><![CDATA[Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Thermal_Management_Materials_3.0W_Silicone--11909846_12019370.html]]></link><description><![CDATA[Thermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Transfer
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which ]]></description><pubDate><![CDATA[20241021]]></pubDate></item>
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<title><![CDATA[Factory Direct Sale 1.5-15W/M.K Thermal Conductive Silicone Pad for LED/LCD/CPU Heat Transfer]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Factory_Direct_Sale_1.5_15W--11869794_11992205.html]]></link><description><![CDATA[filling the cavity, both sides have natural viscosity, strong operability and maintainability;
Working principle:
The basic working principle of thermal conductive silicone pad is the combination of ]]></description><pubDate><![CDATA[20240826]]></pubDate></item>
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<title><![CDATA[High Rebound Thermal Pad]]></title><link><![CDATA[https://emtron11.en.ec21.com/High_Rebound_Thermal_Pad--11931195_11937433.html]]></link><description><![CDATA[filling effect and no damage to components
• High strength, high rebound, and super reliability
TYPICAL APPLICATION
• Telecomm equipment 
• Flat panel displays 
• Automotive electronics 
• ]]></description><pubDate><![CDATA[20240515]]></pubDate></item>
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<title><![CDATA[Thermal Conductive Silicon Thermal Pad 3.0w/M.K Exclusively for CPU 50*50*2mm]]></title><link><![CDATA[https://andychow12.en.ec21.com/Thermal_Conductive_Silicon_Thermal_Pad--10651189_11934116.html]]></link><description><![CDATA[structure not only make the pad with strong heat absorbing ability,also with the initiative heat conduction function,when filling into the gap between heating device and heatsink or metab.
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<title><![CDATA[Thermally Conductive Silicone Interface Pad]]></title><link><![CDATA[https://kingheater.en.ec21.com/Thermally_Conductive_Silicone_Interface_Pad--6154361_7377419.html]]></link><description><![CDATA[pad heatconductive slicone interface pad thermal conductive pad Thermal Insulation Soft Silica Gel Tablets Thermally conductive silicone pad CPU thermally conductive pad silicone gap filler thermal c]]></description><pubDate><![CDATA[20220719]]></pubDate></item>

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