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<title><![CDATA[EC21 Product Catalogs - printed circuit board]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/printed_circuit_board--100303/1/printed circuit board.html]]></link><item>
<title><![CDATA[Electrical Insulation Polyimide Film for Flexible Printed Circuit Board]]></title><link><![CDATA[https://hermangou.en.ec21.com/Electrical_Insulation_Polyimide_Film_for--11778852_11778860.html]]></link><description><![CDATA[Standard of Performance
Thickness 25um
Tensile strength(TD) ≥170Mpa
Tensile strength(MD)≥165Mpa
Elongation≥40 %
Young&apos;s Modulus≥3.1Gpa
Dielectric Constant 3.5±0.4
Dissipation Factor≤0.004
]]></description><pubDate><![CDATA[20230501]]></pubDate></item>
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<title><![CDATA[Hot Press Laminate TPX Film (Adhesive Barrier Release Film)]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/Hot_Press_Laminate_TPX_Film--12047105_12047238.html]]></link><description><![CDATA[printed circuit board (PCB) processing and other fields.
Features 
1. 
Adhesive Resistance : Surface treatments (e.g., low surface energy coatings, micro-textures) or inherent material properties pre]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[Epoxy Resin Fiberglass Sheets FR4 Flame Retardant Epoxy Fiberglass Laminates]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Epoxy_Resin_Fiberglass_Sheets_FR4--12036090_12036095.html]]></link><description><![CDATA[TFUER-T312 (FR4)
* Insulating Materials
T312 is one of the most widely used materials for printed circuit boards (PCBs). It is a fiberglass-reinforced epoxy resin laminate and is the standard materia]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
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<title><![CDATA[Loctite 315]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Loctite_315--11478029_11546533.html]]></link><description><![CDATA[printed circuit board assemblies or heat sinks. In high pot applications this product should be limited to a maximum of 500 volts. Activator 7387 is required for proper curing of Loctite Output adhes]]></description><pubDate><![CDATA[20240729]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials]]></title><link><![CDATA[https://dwcmcoltd.en.ec21.com/Solder_Pallet_Materials--3950532_3950533.html]]></link><description><![CDATA[board, to ensure the quality of reflow process. It is designed and typically recommended for use in manufacturing solder pallets for wave-solder applications of printed circuit boards. The fixtures m]]></description><pubDate><![CDATA[20120409]]></pubDate></item>
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<title><![CDATA[Polyimide Film Tape]]></title><link><![CDATA[https://filmtape.en.ec21.com/Polyimide_Film_Tape--11729864_11729890.html]]></link><description><![CDATA[appliances used in mining; it can be used as high-temperature cable, electromagnetic wire, etc.; it can be made into composite film, flexible copper plate, flexible printed circuit board, etc.
]]></description><pubDate><![CDATA[20230217]]></pubDate></item>

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