<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - reflow]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/reflow--100303/1/reflow.html]]></link><item>
<title><![CDATA[Wave/Reflow Soldering Pallet Materials]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Wave_Reflow_Soldering_Pallet_Materials--12036090_12036092.html]]></link><description><![CDATA[reflow processes, typically up to 300°C.
Can withstand temperatures up to 300°C.
Suitable for high-temperature processes like wave soldering and reflow soldering.
2. Dimensional Stability: It resis]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
<item>
<title><![CDATA[Medical Grade FEP Heat Shrink Tubing  Polyperfluorinated Ethylene-Propylene Material]]></title><link><![CDATA[https://keyusce.en.ec21.com/Medical_Grade_FEP_Heat_Shrink--12064250_12064338.html]]></link><description><![CDATA[reflow/tipping), component insulation, strain relief, and protecting sensitive parts from heat, chemicals, and abrasion due to its excellent chemical inertness, high clarity.
Product Application
KY-M]]></description><pubDate><![CDATA[20251217]]></pubDate></item>
<item>
<title><![CDATA[Polyimide Tape]]></title><link><![CDATA[https://citchem.en.ec21.com/Polyimide_Tape--5741528_5741544.html]]></link><description><![CDATA[reflow soldering processes within the PCB assembly industry. It is used in electrical insulation application meeting class H requirements.
Main Features: 
. Thin and conformable enabling masking of u]]></description><pubDate><![CDATA[20250310]]></pubDate></item>
<item>
<title><![CDATA[Solder Pallet Material]]></title><link><![CDATA[https://changdacm.en.ec21.com/Solder_Pallet_Material--5088980_5088981.html]]></link><description><![CDATA[to the chemicals used in fluxes and also prevents solder pick up. 
Solder pallet material can be used for following applications in SMT assembly: 
Solder paste printing 
SMT placement 
Reflow 
]]></description><pubDate><![CDATA[20241125]]></pubDate></item>
<item>
<title><![CDATA[Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Sil_Pad_Tsp_Q2500--11478029_11501480.html]]></link><description><![CDATA[reflow solder or cleaning operations. Unlike grease, BERGQUIST QII can be used prior to these operations.BERGQUIST Q PAD II also eliminates dust collection which can cause possible surface shorting o]]></description><pubDate><![CDATA[20240822]]></pubDate></item>
<item>
<title><![CDATA[Polyimide Tape]]></title><link><![CDATA[https://swsz88.en.ec21.com/Polyimide_Tape--1624213_11985030.html]]></link><description><![CDATA[reflow processes and the manufacturing processes of all types of electronic components.
Features:
Excellent electrical insulation properties
Excellent dimensional stability
Excellent heat resistance
]]></description><pubDate><![CDATA[20240813]]></pubDate></item>
<item>
<title><![CDATA[Black Kapton Tape]]></title><link><![CDATA[https://hopelightcn.en.ec21.com/Black_Kapton_Tape--11317718_11317724.html]]></link><description><![CDATA[reflow soldering, and the characteristics of good adhesion and no residual glue after removed, which meet the needs of circuit board reflow soldering and fixing.
The use of motors, motors and other e]]></description><pubDate><![CDATA[20210105]]></pubDate></item>
<item>
<title><![CDATA[Solder Pallet Materials]]></title><link><![CDATA[https://dwcmcoltd.en.ec21.com/Solder_Pallet_Materials--3950532_3950533.html]]></link><description><![CDATA[reflow soldering cycle. The low thermal conductivity of the durotone prevents heat-shrinkage of the bas board, to ensure the quality of reflow process. It is designed and typically recommended for us]]></description><pubDate><![CDATA[20120409]]></pubDate></item>

</channel>
</rss>