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<title><![CDATA[EC21 Product Catalogs - semiconductor devices materials]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor_devices_materials--100303/1/semiconductor devices materials.html]]></link><item>
<title><![CDATA[Non-Shrinking FEP Tubing for Electrical Cable Insulation - Chemical Resistant]]></title><link><![CDATA[https://keyusce.en.ec21.com/Non_Shrinking_FEP_Tubing_for--12059650_12063932.html]]></link><description><![CDATA[semiconductor manufacturing, power plants, medical devices (non-implantable), and automotive underhood systems. Compliant with industry standards for chemical inertness and thermal resistance.
Produc]]></description><pubDate><![CDATA[20260316]]></pubDate></item>
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<title><![CDATA[Thermal Paste CPU Cooling Thermal Grease for Gaming Laptop/LED/Circuit Board Heat Transfer]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Thermal_Paste_CPU_Cooling_Thermal--11991936_11992734.html]]></link><description><![CDATA[device;
3.Integrated circuit, CPU memory module;
4.Electronic and electrical heating spare parts;
5.LED lamp, power supply, UPS power supply etc.;
6.Power semiconductor, fever transistor and MOSFET;
]]></description><pubDate><![CDATA[20240827]]></pubDate></item>
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<title><![CDATA[BERGQUIST GAP PAD VO Ultra Soft  GAP PAD TGP 1000VOUS]]></title><link><![CDATA[https://echo19820828.en.ec21.com/BERGQUIST_GAP_PAD_VO_Ultra--11478029_11493813.html]]></link><description><![CDATA[material, which allows its use in applications requiring isolation between heat sinks and highvoltage,bare-leaded devices.BERGQUIST GAP PAD VO Ultra Soft Typical Applications Include:• Telecommunic]]></description><pubDate><![CDATA[20240712]]></pubDate></item>
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<title><![CDATA[Mass Production Power Conversion Equipment Applied Grease 3.8W Gray Silicone High Temperature Therma]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Mass_Production_Power_Conversion_Equipment--11933107_11933125.html]]></link><description><![CDATA[Semiconductor cases and heat sinks
&gt; Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices
&gt; CPU&apos;s and GPU&apos;s
&gt; Automatic dispensing and screen-printing
Typi]]></description><pubDate><![CDATA[20240507]]></pubDate></item>

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