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<title><![CDATA[EC21 Product Catalogs - semiconductor die bonding]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor_die_bonding--100303/1/semiconductor die bonding.html]]></link><item>
<title><![CDATA[Double Side Thermal Conductive Adhesive Tape for Chip PCB LED Strip]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Double_Side_Thermal_Conductive_Adhesive--11935710_11976738.html]]></link><description><![CDATA[bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in eff]]></description><pubDate><![CDATA[20240729]]></pubDate></item>
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<title><![CDATA[Bergquist Gap Filler Tgf 2000 GF2000]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Gap_Filler_Tgf_2000--11478029_11481206.html]]></link><description><![CDATA[die-cut shapes for individual applications. BERGQUIST GAP FILLER 2000 is intended for use in thermal interface applications when a strong structural bond is not required.BERGUQIST TGF 2000 Typical Ap]]></description><pubDate><![CDATA[20240709]]></pubDate></item>

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